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JPS627872A Expired / Lapsed JP ⏱️ 0.0 years remaining

Formation of metallic pattern on surface of synthetic resin

Assignee: National Institute of Advanced Industrial Science and Technology
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Filing: 1985-07-03
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Granted: —
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Expires: 2005-07-03
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Abstract

Abstract PURPOSE:To form a metallic pattern available in the manufacture of a wiring board on the surface of resin with a simple operation by exposing cellulose fiber packed in a molded body of synthetic resin, immersing this in palladium hydrogel and thereafter performing electroless plating thereon. CONSTITUTION:Cellulose fiber is exposed according to a prescribed pattern from the surface of a molded body of synthetic resin such as phenolic resin and melamine resin which is uniformly packed with cellulose fiber such as paper and pulp. Therefor the resin may be cut, abraded and disconnected for example by using a cutter and a file of a hard material made of steel. After washing a molded body of synthetic resin wherein cellulose fiber is exposed in the prescribed part with an organic solvent such as ethanol and washing it with water, it is immersed in palladium hydrosol having 0.01-5mg-atom/l Pd concn. Normally for >=1 minute. Then after washing the resin molded body subjected to the immersion treatment with water, it is immersed in an electroless plating bath to form a metallic pattern on the resin molded body. In such a method, the metallic pattern can be formed on the resin molded body in a simple operation without using a resist and an etching operation.

Inventors

  • 👤 Yukimichi Nakao
  • 👤 幸道 中尾
  • 👤 Kyoji Kaeriyama
  • 👤 帰山 享二
  • 👤 Masao Suda
  • 👤 須田 昌男

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-25 00:27
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1633; C23C18/1635; C23C18/1639; C23C18/1641; C23C18/18; C23C18/20; C23C18/2006; C23C18/2013; C23C18/28; C23C18/30; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182

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