Socket for semiconductor device

Abstract

Abstract PURPOSE:To contrive the improvement of the operability at the time of a monitoring work and of measurement accuracy by constituting the titled socket of a semiconductor device mounting substrate provided with plural protruded lead pins, conductive members formed on the wall surfaces of plural pieces of guide holes wherein the lead pins are inserted and plural pieces of monitoring terminals connected with the conductive members. CONSTITUTION:A substrate 20 is slidingly mounted in an Xa direction and a Yb difection by guide rails and so on provided on a fixing member 2, plural pieces of guide holes 21 having a larger diameter than the pin diameter of lead pins 6a of a semiconductor device 6 to be mounted thereon are bored corresponding to the lead pins 6a and plural pinlike monitoring terminals 22 are protruded upward at the outer periphery parts of the guide holes and also outside of the semiconductor device mounting region. The guide holes 21 and the monitoring terminals 22 are coupled together through a conductor 23 formed on the substrate 20 and a coating for insulating is performed on its surface. Conductive members 24 are each formed on the wall surfaces in the guide holes 21 and the conductive members 24 are connected with the momitoring terminal 22 through the conductor 23. If a monitoring work is carried out using this socket, with the improvement of the operability, the monitoring terminals 22 which should monitor are easy to look for and the accurate monitoring work can be carried out.

Inventors

• 👤 Hiroshi Okino
• 👤 沖野　博
• 👤 Kan Kawanaka
• 👤 河中　敢

Bibliographic Details