Leadless component

Abstract

Abstract PURPOSE:To increase the bonding area of solder, and to augment soldering strength by forming a base recessed section to the periphery of the base of a carrier, communicated with the recessed section of a side wall and shaping a base electrode into the base recessed section. CONSTITUTION:With electrode structure in which a leadless part is soldered and mounted to a circuit substrate 30, side-wall electrodes 6 formed to the inner surfaces of plane-view arched side-wall recessed sections 22 jaxtaposed to the side wall 21 of a carrier 2 are shaped, internal end sections are connected to electrodes for a circuit element 1 through connecting wires, and external end surfaces are combined with the side-wall electrodes 6. Side-view arched base recessed sections 24 are disposed in an array to the periphery of the base 23 of the carrier 2 so as to be communicated with each side-wall recessed section 22, and base electrodes 25 are formed to the inner surfaces of the base recessed sections 24. Accordingly, since the base electrodes 25 are shaped to the arched inner surfaces of the base recessed sections 24, a bonded surface bonded with solder 10 is spread though a projected area is made the same as a conventional base pad, thus increasing soldering strength.

Inventors

• 👤 Tetsuo Kurokawa
• 👤 黒川　哲夫

Bibliographic Details