Electronic device

Abstract

Abstract PURPOSE:To obtain an electronic device increasing the fixing strength of a lead pin while being able to inhibit the thickness of a package by allowing a collar to protrude so as to be brought into contact with the opening edge of a through hole in the outer surface of a substrate in the lead pin inserted into the through-hole in the substrate and openly providing the collar with a notch section in the radial direction. CONSTITUTION:Collars 12 are allowed to protrude so as to be brought into contact with the opening edges of through-holes 3 in the outer surface of a substrate 2 in lead pins 10 inserted into the through holes 3 openly formed to the substrate 2 while the collars 12 are provided openly with notch sections 13 in the radial direction. Positioning sections 11 are crushed and formed to a circular plate shape so as to be fast stuck onto the inner circumferential surfaces of through-hole conductors 8 applied to the through-holes 3 in sections inserted into the through-holes 3 of the lead pins 10. The approximately circular annular collars 12 are arranged at the lower positions of the positioning sections 11 on the outer circumferences of the lead pins 10, and allowed to protrude toward the rectangular outside direction, and the notch sections 13 are disposed at approximately regular intervals in the circumferential direction at a plurality of positions in the collars 12, and notched up to the outer circumferences of the pins from the outer circumferences and formed to an approximately fan shape.

Inventors

• 👤 Tomio Yamada
• 👤 富男 山田

Bibliographic Details