Integrated circuit package

Abstract

Abstract PURPOSE:To improve the cooling efficiency of a heatsink and eliminate the restriction against wirings by a method wherein a screw hole is formed in the part of a base, on which an LSI chip is mounted, which is exposed from the bottom of a package and the heatsink which has a screw mated with the screw hole is connected to the base with a substrate on which the package is formed between. CONSTITUTION:An LSI chip 7 is placed in a package main body 1 through an opening provided in the upper surface of the package main body 1. A base 2 which has a protrusion 2a protruding outward at its center is provided on the inner bottom of the main body 1. The protrusion 2a is exposed on the outer bottom surface of the main body 1 and fixed. The chip 7 is fixed on the base 2 and the inside of the main body 1 is air-tightly sealed with a cover 3. A plurality of lead pine 4 are provided on the base 2 and the lead pins 4 are fitted in pin insertion holes formed in a printed board 8. A screw hole is provided in the protrusion 2a at the center of the base 2 and a screw 5a provided at the center of a heatsink 5 is screwed into the screw hole and fixed so that the heatsink 5 can be securely connected to the package main body 1 with the board 8 between.

Inventors

• 👤 Shigenobu Nagasawa
• 👤 長沢　重信

Bibliographic Details