Semiconductor device

Abstract

Abstract PURPOSE:To facilitate an alignment process without reducing a yield rate of chips from a wafer substrate by a method wherein, in a semiconductor wafer where the strip-shaped chips are arranged, the width of a scribing line sandwiched between short sides is made wider than the width of the scribing line sandwiched between long sides. CONSTITUTION:Strip-shaped IC patterns 12 of 1.25X7.25 mm are formed in an effective region 15 mm square of a reticle 11 in such a way that their short sides are arranged horizontally in the right and left directions. The width of a scribing line 23 between long sides in a region of the IC patterns 12 transcribed onto a silicon wafer substrate 13 is determined to be 60 mum which is necessary for a dicing operation. On the other hand, the width of a scribing line 24 between short sides is determined to be 160 mum; an automatic alignment mark 25 for PJA use and a TEG pattern 26 such as a transistor for a process monitor use, a resistor or the like are arranged in said width. All the IC patterns of the reticle are exposed as one shot unit 16 on the silicon wafer substrate 13 by using a stepper by means of the reticle 11, threreby performing stepping exposure.

Inventors

• 👤 Yukio Morozumi
• 👤 幸男 両角

Bibliographic Details