US20030197312A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of fabricating a precision microcontact printing stamp
Assignee: GlobalFoundries US Inc
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Filing: 2002-04-22
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Granted: —
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Expires: 2022-04-22
Abstract
Abstract A process of making a high precision microcontact printing stamp in which an elastomeric monomer or oligomer is introduced into a mold wherein a photoresist master imprinted with a microcircuit design in negative relief is predisposed. The monomer or oligomer is cured at a temperature no higher than about ambient temperature whereby a distortion-free microcontact printing stamp having the microcircuit design of the photoresist master in positive relief is formed.
Inventors
- 👤 Gareth Hougham
- 👤 Peter Fryer
- 👤 Ronald Nunes
- 👤 Mary Rothwell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 13:56
CPC Classifications
B; B29; B29C; B29C35/00; B29C35/02; B29C35/08; B29C35/0888; B29C35/18; B29C35/0805; B29C2035/0827; B29C2791/00; B29C2791/004; B29C35/007; B29K; B29K2021/00; B29K2105/00; B29K2105/0002
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
107 words
1 . A process for making a microcontact printing stamp comprising the steps of: predisposing a photoresist master having a microcircuit design in negative relief above a flexible stamp backplane in a mold; introducing a liquid elastomeric monomer or oligomer mixture into said mold so that said monomer or oligomer fills the space between said photoresist master and said flexible stamp backplane; curing said liquid elastomeric monomer or oligomer to form an elastomeric polymer at a temperature of no more than about ambient; and removing a cured elastomeric printing stamp, disposed on said flexible backplane, whose top surface conforms to the microcircuit design of said photoresist master.
Claim 2
Dependent Claim
107 words
1 . A process for making a microcontact printing stamp comprising the steps of: predisposing a photoresist master having a microcircuit design in negative relief above a flexible stamp backplane in a mold; introducing a liquid elastomeric monomer or oligomer mixture into said mold so that said monomer or oligomer fills the space between said photoresist master and said flexible stamp backplane; curing said liquid elastomeric monomer or oligomer to form an elastomeric polymer at a temperature of no more than about ambient; and removing a cured elastomeric printing stamp, disposed on said flexible backplane, whose top surface conforms to the microcircuit design of said photoresist master.
Claim 3
Dependent Claim
17 words
2 . A process in accordance with claim 1 wherein said curing temperature is about ambient temperature.
Claim 4
Dependent Claim
25 words
3 . A process in accordance with claim 1 wherein said curing temperature is between about 1° C. and about 5° C. below ambient temperature.
Claim 5
Dependent Claim
20 words
4 . A process in accordance with claim 3 wherein said curing temperature is about 3° C. below ambient temperature.
Claim 6
Dependent Claim
39 words
5 . A process in accordance with claim 3 wherein said elastomeric monomer is photocurable, said mold is transparent to ultraviolet light and said step of curing occurs while said elastomeric monomer or oligomer is exposed to ultraviolet light.
Claim 7
Dependent Claim
17 words
6 . A process in accordance with claim 1 wherein said curing step occurs under isothermal conditions.
Claim 8
Dependent Claim
24 words
7 . A process in accordance with claim 6 wherein said mold is hermetically sealed and immersed in constant temperature liquid environment during curing.
Claim 9
Dependent Claim
18 words
8 . A process in accordance with claim 7 where said constant temperature environment is a liquid bath.
Claim 10
Dependent Claim
17 words
9 . A process in accordance with claim 8 wherein said liquid bath is a water bath.
Claim 11
Dependent Claim
30 words
10 . A process in accordance with claim 3 wherein said step of removing said stamp from said mold occurs subsequent to the warming of said stamp to ambient temperature.
References Cited (Backward Citations)
US5776748A
Cited
US6048623A
Cited
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