← Back to Patent Explorer
US3100339A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making composite bodies

Assignee: General Electric Co
•
Filing: 1958-06-11
•
Granted: 1963-08-13
•
Expires: 1978-06-11
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Ralph J Bondley

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 02:49
CPC Classifications
C; C03; C03C; C03C27/00; C03C27/04; C03C27/042; C03C27/046; C04; C04B; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/63416; C04B37/00; C04B37/02; C04B37/023; C04B37/026; C04B2235/00; C04B2235/02; C04B2235/50; C04B2235/54; C04B2235/5418; C04B2235/5436; C04B2235/65; C04B2235/656; C04B2235/6567; C04B2235/658; C04B2235/6581; C04B2237/00; C04B2237/02; C04B2237/12; C04B2237/122; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/341; C04B2237/40; C04B2237/408; C04B2237/50; C04B2237/59; C04B2237/592; C04B2237/70; C04B2237/704; C04B2237/708; C04B2237/72; C04B2237/76; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/939; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 229 words
THE METHOD OF FORMING A HERMETIC BOND CAPABLE OF WITHSTANDING HIGH TEMPERATURES BETWEEN A QUARTZ MEMBER AND A METAL MEMBER WHICH COMPRISES APPLYING A THIN LAYER OF A POWDERED METAL HYDRIDE AND A LOW-MELTING POINT DUCTILE SOLDER TO THE SURFACE OF THE QUARTZ MEMBER TO BE BONDED, THE METAL OF THE HYDRIDE BEING SELECTED FROM THE GROUP CONSISTING OF ZIRCONIUM, TITANIUM AND MIXTURES THEREOF, THE LOW MELTING POINT DUCTILE SOLDER BEING SELECTED FROM THE GROUP CONSISTING OF INDIUM, THALLIUM, THIN, CADMIUM, ZINC AND GALLIUM AND THE METAL MEMBER BEING SELECTED FRM THE GROUP CONSISTING OF SILVER, GOLD AND COPPER, THE COMBINATIONS OF THALLIUM WITH GOLD AND COPPER AND CADMIUM WITH COPPER BEING EXCLUDED, HEATING THE COATED MEMBER IN A NONREACTIVE ATMOSPHERE TO DISSOCIATE THE HYDRIDE AND ALLOY THE LIBERATED METAL OF THE HYDRIDE AND THE SOLDER AND BOND THE COATING TO THE QUARTZ MEMBER, PLACING THE QUARTZ MEMBER WITH THE COATED AREA IN JUXTAPOSITION TO THE METAL MEMBER, HEATING THE MEMBERS TO ALLOY THE STRUCTURAL MEMBER WITH LOWMELTING-POINT DUCTILE SOLDER, LIMITING THE THICKNESS OF THE DUCTIBLE SOLDER SUFFICIENTLY TO PROVIDE ONLY A SMALLY AMOUNT OF FREE DUCTILE SOLDER RELATIVE TO THE STRUCTURAL MEMBER AVAILABLE FOR ALLOYING THEREWITH TO INSURE THE FORMATION DURING THE SECOND HEATING STEP OF ONLY AN ALPHA-PHASE ALLOY TO PROVIDE A BOND CAPABLE OF WITHSTANDING TEMPERATURES SUBSTANTIALLY HIGHER THAN THE MELTING POINT OF THE DUCTILE SOLDER.
Claim 2
Independent Claim 229 words
THE METHOD OF FORMING A HERMETIC BOND CAPABLE OF WITHSTANDING HIGH TEMPERATURES BETWEEN A QUARTZ MEMBER AND A METAL MEMBER WHICH COMPRISES APPLYING A THIN LAYER OF A POWDERED METAL HYDRIDE AND A LOW-MELTING POINT DUCTILE SOLDER TO THE SURFACE OF THE QUARTZ MEMBER TO BE BONDED, THE METAL OF THE HYDRIDE BEING SELECTED FROM THE GROUP CONSISTING OF ZIRCONIUM, TITANIUM AND MIXTURES THEREOF, THE LOW MELTING POINT DUCTILE SOLDER BEING SELECTED FROM THE GROUP CONSISTING OF INDIUM, THALLIUM, THIN, CADMIUM, ZINC AND GALLIUM AND THE METAL MEMBER BEING SELECTED FRM THE GROUP CONSISTING OF SILVER, GOLD AND COPPER, THE COMBINATIONS OF THALLIUM WITH GOLD AND COPPER AND CADMIUM WITH COPPER BEING EXCLUDED, HEATING THE COATED MEMBER IN A NONREACTIVE ATMOSPHERE TO DISSOCIATE THE HYDRIDE AND ALLOY THE LIBERATED METAL OF THE HYDRIDE AND THE SOLDER AND BOND THE COATING TO THE QUARTZ MEMBER, PLACING THE QUARTZ MEMBER WITH THE COATED AREA IN JUXTAPOSITION TO THE METAL MEMBER, HEATING THE MEMBERS TO ALLOY THE STRUCTURAL MEMBER WITH LOWMELTING-POINT DUCTILE SOLDER, LIMITING THE THICKNESS OF THE DUCTIBLE SOLDER SUFFICIENTLY TO PROVIDE ONLY A SMALLY AMOUNT OF FREE DUCTILE SOLDER RELATIVE TO THE STRUCTURAL MEMBER AVAILABLE FOR ALLOYING THEREWITH TO INSURE THE FORMATION DURING THE SECOND HEATING STEP OF ONLY AN ALPHA-PHASE ALLOY TO PROVIDE A BOND CAPABLE OF WITHSTANDING TEMPERATURES SUBSTANTIALLY HIGHER THAN THE MELTING POINT OF THE DUCTILE SOLDER.

References Cited (Backward Citations)

US2322507A Cited
US2163409A Cited
GB591343A Cited
US2496346A Cited
US2512455A Cited
US2570248A Cited
US2650683A Cited
US2686958A Cited
US2724892A Cited
US2746140A Cited
US2776472A Cited
US2859512A Cited
US2917140A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1966-08-12 1967-02-11 1967-08-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1970-08-12 1971-02-11 1971-08-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1974-08-12 1975-02-11 1975-08-13 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag