US3226821A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and means for dip soldering printed circuit panels
Assignee: US Philips Corp
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Filing: 1962-02-08
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Granted: 1966-01-04
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Expires: 1982-02-08
Abstract
No abstract record available.
Inventors
- 👤 Johannes Henricus Joseph Dijk
- 👤 Henri Carel Haverkor Rijsewijk
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0669; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0165
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
92 words
A METHOD OF DIP SOLDERING PRINTED CIRCUIT BOARDS WHICH IS PARTICULARLY USEFUL IN SOLDERING CIRCUIT BOARDS HAVING CLOSELY SPACED COMPONENT LEADS COMPRISING, SUPPORTING SAID CIRCUIT BOARD WITH AT LEAST THE LEADS OF SAID COMPONENTS IN CONTACT WITH THE SURFACE OF A SOLDER BATH, MOVING A POROUS MEMBER NORMALLY LOCATED BELOW THE SURFACE OF SAID SOLDER BATH INTO CONTACT WITH SAID LEADS, RAISING BOTH SAID CIRCUIT BOARD AND POROUS MEMBER ABOVE SAID BATH SURFACE WHILE HELD IN CONTACT WITH ONE ANOTHER, AND SEPARATING SAID BOARD AND MEMBER BEFORE SOLIDIFICATION OF THE SOLDER THEREON.
Claim 2
Independent Claim
92 words
A METHOD OF DIP SOLDERING PRINTED CIRCUIT BOARDS WHICH IS PARTICULARLY USEFUL IN SOLDERING CIRCUIT BOARDS HAVING CLOSELY SPACED COMPONENT LEADS COMPRISING, SUPPORTING SAID CIRCUIT BOARD WITH AT LEAST THE LEADS OF SAID COMPONENTS IN CONTACT WITH THE SURFACE OF A SOLDER BATH, MOVING A POROUS MEMBER NORMALLY LOCATED BELOW THE SURFACE OF SAID SOLDER BATH INTO CONTACT WITH SAID LEADS, RAISING BOTH SAID CIRCUIT BOARD AND POROUS MEMBER ABOVE SAID BATH SURFACE WHILE HELD IN CONTACT WITH ONE ANOTHER, AND SEPARATING SAID BOARD AND MEMBER BEFORE SOLIDIFICATION OF THE SOLDER THEREON.
Claim 3
Dependent Claim
88 words
APPARATUS FOR DIP SOLDERING A PRINTED CIRCUIT BOARD COMPRISING MEANS CONTAINING A LIQUID SOLDER BATH, MOVABLE GUIDE MEANS FOR SUPPORTING A CIRCUIT BOARD IN CONTACT WITH THE SURFACE OF SAID BATH, POROUS MEANS BELOW THE SURFACE OF SAID BATH, MEANS CONNECTED WITH SAID POROUS MEANS FOR RAISING SAID POROUS MEANS INTO ABUTMENT WITH SAID CIRCUIT BOARD AT THE SURFACE OF SAID BATH, AND MEANS FOR MAINTAINING SAID ABUTMENT WHILE RAISING SAID BOARD AND POROUS MEANS ABOVE THE SURFACE OF SAID SOLDER BATH AND SEPARATING THEM ABOVE SAID SURFACE.
Claim 4
Dependent Claim
88 words
APPARATUS FOR DIP SOLDERING A PRINTED CIRCUIT BOARD COMPRISING MEANS CONTAINING A LIQUID SOLDER BATH, MOVABLE GUIDE MEANS FOR SUPPORTING A CIRCUIT BOARD IN CONTACT WITH THE SURFACE OF SAID BATH, POROUS MEANS BELOW THE SURFACE OF SAID BATH, MEANS CONNECTED WITH SAID POROUS MEANS FOR RAISING SAID POROUS MEANS INTO ABUTMENT WITH SAID CIRCUIT BOARD AT THE SURFACE OF SAID BATH, AND MEANS FOR MAINTAINING SAID ABUTMENT WHILE RAISING SAID BOARD AND POROUS MEANS ABOVE THE SURFACE OF SAID SOLDER BATH AND SEPARATING THEM ABOVE SAID SURFACE.
References Cited (Backward Citations)
US2877731A
Cited
US2918028A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-01-03 | 1969-07-05 | 1970-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-01-03 | 1973-07-05 | 1974-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-01-03 | 1977-07-05 | 1978-01-04 | $7700.00 | Window Closed / Lapsed |