US3237272A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making semiconductor device
Assignee: Motorola Solutions Inc
•
Filing: 1965-07-06
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Granted: 1966-03-01
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Expires: 1985-07-06
Abstract
No abstract record available.
Inventors
- 👤 David A Kallander
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W20/00; H10W20/40; H10W20/45; H10W20/48; Y; Y10; Y10S; Y10S438/00; Y10S438/958
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
126 words
A PROCESS FOR MAKING A DIODE, COMRISING DIFFUSING A P IMPURITY INTO ONE SIDE OF A SILICON WAFER OF A SELECTED CONDUCTIVITY TYPE AND DIFFUSING AN N IMPURITY INTO THE OPPOSITE SIDE THEREOF TO FORM A THREE LAYER JUNCTION STRUCTURE, PLATING NICKEL ON BOTH SIDES OF SAID WAFER, PLATING RHODIUM OVER THE NICKEL, BREAKING SAID WAFER INTO DICE, PASSIVATING BY EXPOSING SAID DICE TO AN ATMOSPHERE CONTAINING LEAD OXIDE VAPORS AND OXYGEN AT A TEMPERATURE IN THE RANGE FORM 400*C. TO 750*C. TO FORM A LEAD SILICATE GLASS FILM AROUNG THE EDGES OF SAID DICE COVERING THE JUNCTIONS THEREIN, SOLDERING TWO LEADS TO THE OPPOSITE SIDES OF EACH SAID DIE ELEMENT, AND ENCAPSULATING EACH DIE ELEMENT AND ADJOING PORTIONS OF THE LEADS THEREFOR WITH PLASTIC MATERIAL.
Claim 2
Dependent Claim
126 words
A PROCESS FOR MAKING A DIODE, COMRISING DIFFUSING A P IMPURITY INTO ONE SIDE OF A SILICON WAFER OF A SELECTED CONDUCTIVITY TYPE AND DIFFUSING AN N IMPURITY INTO THE OPPOSITE SIDE THEREOF TO FORM A THREE LAYER JUNCTION STRUCTURE, PLATING NICKEL ON BOTH SIDES OF SAID WAFER, PLATING RHODIUM OVER THE NICKEL, BREAKING SAID WAFER INTO DICE, PASSIVATING BY EXPOSING SAID DICE TO AN ATMOSPHERE CONTAINING LEAD OXIDE VAPORS AND OXYGEN AT A TEMPERATURE IN THE RANGE FORM 400*C. TO 750*C. TO FORM A LEAD SILICATE GLASS FILM AROUNG THE EDGES OF SAID DICE COVERING THE JUNCTIONS THEREIN, SOLDERING TWO LEADS TO THE OPPOSITE SIDES OF EACH SAID DIE ELEMENT, AND ENCAPSULATING EACH DIE ELEMENT AND ADJOING PORTIONS OF THE LEADS THEREFOR WITH PLASTIC MATERIAL.
References Cited (Backward Citations)
US2728693A
Cited
US2890395A
Cited
US2964831A
Cited
US3046176A
Cited
GB878544A
Cited
US2994054A
Cited
US2930722A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-02-28 | 1969-08-30 | 1970-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-02-28 | 1973-08-30 | 1974-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-02-28 | 1977-08-30 | 1978-03-01 | $7700.00 | Window Closed / Lapsed |