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US3239789A Expired / Lapsed US ⏱️ 0.0 years remaining

Molded conductive plastic resistor and method of making same

Assignee: ACE ELECTRONICS ASSOCIATES Inc
•
Filing: 1963-10-10
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Granted: 1966-03-08
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Expires: 1983-10-10
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Abstract

No abstract record available.

Inventors

  • 👤 Daniel N Shaheen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 03:47
CPC Classifications
H; H01; H01C; H01C17/00; H01C10/00; H01C10/30; H01C10/305; H01C10/306

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 107 words
A METHOD OF FORMING A MOLDED RESISTOR UNIT, COMPRISING THE STEPS OF: DEPOSITING A LAYER OF A SOLUTION OF A THERMOSETTING RESIN IN A SOLVENT HAVING A POWDERED CONDUCTIVE MATERIAL HOMOGENEOUSLY ADMIXED THEREWITH, IN A SHAPE APPROXIMATING THAT DESIRED FOR THE RESISTOR; BAKING THE DEPOSITED LAYER AT CURING TEMPERATURE FOR THE RESIN TO EVAPORATE THE SOLVENT AND EFFECT A PARTIAL CURE OF THE RESIN; AND COMOLDING IN A MOLD AND FULLY CURING SAID DEPOSITED LAYER WITH A BASE MATERIAL THEREFOR COMPRISED OF A THERMOSETTING RESIN; SAID COMOLDING STEP BEING EFFECTED WITH A SURFACE OF SAID LAYER IN PRESSURE CONTACT WITH A SMOOTH MOLDING SURFACE OF THE MOLD.
Claim 2
Independent Claim 107 words
A METHOD OF FORMING A MOLDED RESISTOR UNIT, COMPRISING THE STEPS OF: DEPOSITING A LAYER OF A SOLUTION OF A THERMOSETTING RESIN IN A SOLVENT HAVING A POWDERED CONDUCTIVE MATERIAL HOMOGENEOUSLY ADMIXED THEREWITH, IN A SHAPE APPROXIMATING THAT DESIRED FOR THE RESISTOR; BAKING THE DEPOSITED LAYER AT CURING TEMPERATURE FOR THE RESIN TO EVAPORATE THE SOLVENT AND EFFECT A PARTIAL CURE OF THE RESIN; AND COMOLDING IN A MOLD AND FULLY CURING SAID DEPOSITED LAYER WITH A BASE MATERIAL THEREFOR COMPRISED OF A THERMOSETTING RESIN; SAID COMOLDING STEP BEING EFFECTED WITH A SURFACE OF SAID LAYER IN PRESSURE CONTACT WITH A SMOOTH MOLDING SURFACE OF THE MOLD.

References Cited (Backward Citations)

USRE18818E Cited
US2056928A Cited
US1889379A Cited
US1992529A Cited
US2134870A Cited
US2700719A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1969-03-07 1969-09-06 1970-03-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1973-03-07 1973-09-06 1974-03-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1977-03-07 1977-09-06 1978-03-08 $7700.00 Window Closed / Lapsed

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