Heat transfer apparatus

Claim 1

APPARATUS FOR COOLING A SEMICONDUCTOR DEVICE COMPRISING, A CONDUCTING PLATE OF MATERIAL OF HIGH THERMAL CONDUCTIVITY, A PLURALITY OF FINS OF MATERIAL OF HIGH THERMAL CONDUCTIVITY PERPENDICULAR TO AND IN GOOD THERMAL CONTACT WITH SAID PLATE, EACH FIN EXTENDING FROM THE PERIMETER OF SAID PLATE WITH THE PLANE OF EACH FIN ESSENTIALLY IN A RADIAL PLANE EMANATING FROM THE CENTER OF SAID PLATE, THE EDGES OF SAID FINS INSIDE OF SAID PERIMETER COACTING WITH THE CENTRAL PORTION OF SAID PLATE TO DEFINE A VOLUME FOR SUPPORTING A SEMICONDUCTOR DEVICE TO BE COOLED WITH SAID FINS DEFINING RADIAL PASSAGES EXTENDING FROM SAID VOLUME TO THE OUTSIDE OF SAID PERIMETER ALONG THE ENTIRE PERIMETER LENGTH WITH EACH RADIAL PASSAGE FROM SAID VOLUME TO SAID PERIMETER EMBRACED ALONG THE ENTIRE PASSAGE LENGTH BY AN EMBRACING PAIR OF SAID FINS, THE SEPARATION BETWEEN ADJACENT FINS BEING LESS THAN THE HEIGHT OF EACH FIN.