Microelectronic module package

Claim 1

A MICROELECTRONIC MODULE PACKAGE ADAPTED TO BE MOUNTED BETWEEN A FIRST STRUCTURAL MEMBER AND A SECOND STRUCTURAL MEMBER COMPRISING: (A) A HEAT SINK FORMED OF A FLAT PLATE MEMBER HAVING A FIRST SIDE AND A SECOND SIDE, SAID FLAT PLATE MEMBER HAVING A CENTRAL SECTION, A FIRST END FLANGE SECTION, AND A SECOND END FLANGE SECTION, SAID CENTRAL SECTION HAVING FIRST AND SECOND OPPOSITE END PORTIONS, SAID FIRST END THIRD AND FOURTH OPPOSITE END PORTIONS, SAID FIRST END FLANGE SECTION AND SAID SECOND END FLANGE SECTION BEING INTEGRAL WITH SAID FIRST AND SECOND OPPOSITE END PORTIONS, RESPECTIVELY, AND PERPENDICULAR TO SAID CENTRAL SECTION; (B) MEANS FOR SECURING SAID FIRST END FLANGE SECTION AND SAID SECOND END FLANGE SECTION TO SAID FIRST STRUCTURAL MEMBER AND SAID SECOND STRUCTURAL MEMBER, RESPECTIVELY; (C) MEANS FOR MOUNTING ELECTRICAL COINNECTORS AT SAID CENTRAL SECTION COMPRISING LEAD WIRE BLOCKS FLUSH MOUNTED TO SAID HEAT SINK AT SAID THIRD AND FOURTH END PORTIONS; (D) A FIRST SERIES OF CONNECTORS MOUNTED IN SAID WIRE BLOCKS AND EXTENDING PERPENDICULAR TO SAID HEAT SINK CENTRAL SECTION AND OUTWARDLY FROM SAID WIRE BLOCKS; (E) A SECOND SERIES OF CONNECTORS EXTENDING OUTWARDLY FROM SAID WIRE BLOCK AND PERPENDICULAR TO SAID FIRST SERIES OF CONNECTORS; (F) A SUBSTRATE OF ELECTRICALLY NON-CONDUCTED MATERIAL SUPERIMPOSED ON AT LEAST ONE OF SAID HEAT SINK SIDES; (G) AN ELECTRICAL CIRCUIT POSITIONED ON AT LEAST ONE OF SAID HEAT SINK SIDES; AND (H) MEANS FOR COUPLING SAID ELECTRICAL CIRCUIT TO SAID SERIES OF CONNECTORS.