Mounting for semiconductor devices

Claim 1

MOUNTING MEANS FOR A CIRCUIT ELEMENT PACKAGED IN A CASE HAVING A PERIPHERAL FLANGE AND LEADS PROJECTING FROM THE LOWER SURFACE THEREOF, SAID MEANS FUNCTIONING TO MOUNT SAID CIRCUIT ELEMENT ONTO A HEAT CONDUCTIVE STRUCTURAL MEMBER, WHEREIN AN INSULATIVE, LOW HEAT CONDUCTIVE, SOCKET-LIKE MEMBER IS DISPOSED ON SAID STRUCTURAL MEMBER FOR RECEIVING SAID LEADS SAID MOUNTING MEANS COMPRISING: (A) A BASE MEMBER OF HIGH THERMAL CONDUCTIVITY FOR POSITIONING ON SAID STRUCTURAL MEMBER, THE BASE MEMBER HAVING AN OPENING CORRESPONDING IN CROSS SECTION TO SAID SOCKET-LIKE MEMBER, (B) A THIN ELECTRICALLY NONCONDUCTIVE PLATE MEMBER OF GOOD THERMAL CONDUCTIVITY POSITIONED OVER THE BASE MEMBER, THE PLATE MEMBER BEING APERTURED WHEREBY THE LEADS OF THE CIRCUIT ELEMENT MAY PASS THROUGH TO ENGAGE THE SOCKET-LIKE MEMBER, (C) A DEFORMABLE SHEET MEMBER FOR OVERLYING THE PLATE MEMBER AND HAVING AN APERTURE MEMBER SMALLER THAN THE PERIPHERAL FLANGE WHEREBY THE SHEET MEMBER WHEN THE FITTED OVER THE CASE WILL HOLD THE FLANGE AGAINST THE PLATE MEMBER, AND (D) MEANS FOR SECURING THE BASE MEMBER AND THE PLATE MEMBER TO THE STRUCTURAL MEMBER AND FOR SECURING THE SHEET MEMBER TO THE PLATE MEMBER.