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US3421040A Expired / Lapsed US ⏱️ 0.0 years remaining

Circuit support for microwave tubes employing shaped dielectric supports rods to capture a ductile material at the support joints

Assignee: Varian Medical Systems Inc
•
Filing: 1966-11-03
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Granted: 1969-01-07
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Expires: 1986-11-03
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Abstract

No abstract record available.

Inventors

  • 👤 Lester M Winslow

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 10:11
CPC Classifications
H; H01; H01J; H01J23/00; H01J23/16; H01J23/24; H01J23/26; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49016

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 141 words
IN A MICROWAVE TUBE APPARATUS, MEANS FOR FORMING AND PROJECTING A BEAM OF ELECTRONS OVER A BEAM PATH, MEANS FOR COLLECTING AND DISSIPATING THE ENERGY OF THE BEAM, MEANS FORMING A MICROWAVE CIRCUIT DISPOSED ALONG THE BEAM PATH IN ENERGY EXCHANGING RELATION WITH THE BEAM, MEANS FORMING A SUPPORT STRUCTURE FOR SUPPORTING SAID MICROWAVE CIRCUIT, MEANS FORMING AND ELECTRICALLY INSULATIVE STRUCTURE DISPOSED BETWEEN SAID CIRCUIT AND SAID SUPPORT STRUCTURE, FOR SUPPORTING SAID CIRCUIT FROM SAID SUPPORT STRUCTURE, MEANS FORMING A DUCTILE THERMALLY CONDUCTIVE PAD ABUTTING SAID CIRCUIT, AND SAID INSULATIVE STRUCTURE HAVING AN INWARDLY DISHED SURFACE FACING SAID DUCTILE PAD CAPTURING SAID DUCTILE PAD THEREWITHIN TO FORM A THERMALLY CONDUCTIVE SUPPORT JOINT FROM SAID CIRCUIT THROUGH SAID PAD AND INSULATIVE STRUCTURE TO SAIS SUPPORT STRUCTURE, WHEREBY CONDUCTION COOLING OF SAID CIRCUIT THROUGH SAID INSULATIVE STRUCTURE TO SAID SUPPORT STRUCTURE IS ENHANCED.
Claim 2
Dependent Claim 141 words
IN A MICROWAVE TUBE APPARATUS, MEANS FOR FORMING AND PROJECTING A BEAM OF ELECTRONS OVER A BEAM PATH, MEANS FOR COLLECTING AND DISSIPATING THE ENERGY OF THE BEAM, MEANS FORMING A MICROWAVE CIRCUIT DISPOSED ALONG THE BEAM PATH IN ENERGY EXCHANGING RELATION WITH THE BEAM, MEANS FORMING A SUPPORT STRUCTURE FOR SUPPORTING SAID MICROWAVE CIRCUIT, MEANS FORMING AND ELECTRICALLY INSULATIVE STRUCTURE DISPOSED BETWEEN SAID CIRCUIT AND SAID SUPPORT STRUCTURE, FOR SUPPORTING SAID CIRCUIT FROM SAID SUPPORT STRUCTURE, MEANS FORMING A DUCTILE THERMALLY CONDUCTIVE PAD ABUTTING SAID CIRCUIT, AND SAID INSULATIVE STRUCTURE HAVING AN INWARDLY DISHED SURFACE FACING SAID DUCTILE PAD CAPTURING SAID DUCTILE PAD THEREWITHIN TO FORM A THERMALLY CONDUCTIVE SUPPORT JOINT FROM SAID CIRCUIT THROUGH SAID PAD AND INSULATIVE STRUCTURE TO SAIS SUPPORT STRUCTURE, WHEREBY CONDUCTION COOLING OF SAID CIRCUIT THROUGH SAID INSULATIVE STRUCTURE TO SAID SUPPORT STRUCTURE IS ENHANCED.

References Cited (Backward Citations)

US2922067A Cited
US3300677A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1972-01-07 1972-07-08 1973-01-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1976-01-07 1976-07-08 1977-01-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1980-01-07 1980-07-08 1981-01-07 $7700.00 Window Closed / Lapsed

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