US3421040A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit support for microwave tubes employing shaped dielectric supports rods to capture a ductile material at the support joints
Assignee: Varian Medical Systems Inc
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Filing: 1966-11-03
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Granted: 1969-01-07
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Expires: 1986-11-03
Abstract
No abstract record available.
Inventors
- 👤 Lester M Winslow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:11
CPC Classifications
H; H01; H01J; H01J23/00; H01J23/16; H01J23/24; H01J23/26; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49016
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
141 words
IN A MICROWAVE TUBE APPARATUS, MEANS FOR FORMING AND PROJECTING A BEAM OF ELECTRONS OVER A BEAM PATH, MEANS FOR COLLECTING AND DISSIPATING THE ENERGY OF THE BEAM, MEANS FORMING A MICROWAVE CIRCUIT DISPOSED ALONG THE BEAM PATH IN ENERGY EXCHANGING RELATION WITH THE BEAM, MEANS FORMING A SUPPORT STRUCTURE FOR SUPPORTING SAID MICROWAVE CIRCUIT, MEANS FORMING AND ELECTRICALLY INSULATIVE STRUCTURE DISPOSED BETWEEN SAID CIRCUIT AND SAID SUPPORT STRUCTURE, FOR SUPPORTING SAID CIRCUIT FROM SAID SUPPORT STRUCTURE, MEANS FORMING A DUCTILE THERMALLY CONDUCTIVE PAD ABUTTING SAID CIRCUIT, AND SAID INSULATIVE STRUCTURE HAVING AN INWARDLY DISHED SURFACE FACING SAID DUCTILE PAD CAPTURING SAID DUCTILE PAD THEREWITHIN TO FORM A THERMALLY CONDUCTIVE SUPPORT JOINT FROM SAID CIRCUIT THROUGH SAID PAD AND INSULATIVE STRUCTURE TO SAIS SUPPORT STRUCTURE, WHEREBY CONDUCTION COOLING OF SAID CIRCUIT THROUGH SAID INSULATIVE STRUCTURE TO SAID SUPPORT STRUCTURE IS ENHANCED.
Claim 2
Dependent Claim
141 words
IN A MICROWAVE TUBE APPARATUS, MEANS FOR FORMING AND PROJECTING A BEAM OF ELECTRONS OVER A BEAM PATH, MEANS FOR COLLECTING AND DISSIPATING THE ENERGY OF THE BEAM, MEANS FORMING A MICROWAVE CIRCUIT DISPOSED ALONG THE BEAM PATH IN ENERGY EXCHANGING RELATION WITH THE BEAM, MEANS FORMING A SUPPORT STRUCTURE FOR SUPPORTING SAID MICROWAVE CIRCUIT, MEANS FORMING AND ELECTRICALLY INSULATIVE STRUCTURE DISPOSED BETWEEN SAID CIRCUIT AND SAID SUPPORT STRUCTURE, FOR SUPPORTING SAID CIRCUIT FROM SAID SUPPORT STRUCTURE, MEANS FORMING A DUCTILE THERMALLY CONDUCTIVE PAD ABUTTING SAID CIRCUIT, AND SAID INSULATIVE STRUCTURE HAVING AN INWARDLY DISHED SURFACE FACING SAID DUCTILE PAD CAPTURING SAID DUCTILE PAD THEREWITHIN TO FORM A THERMALLY CONDUCTIVE SUPPORT JOINT FROM SAID CIRCUIT THROUGH SAID PAD AND INSULATIVE STRUCTURE TO SAIS SUPPORT STRUCTURE, WHEREBY CONDUCTION COOLING OF SAID CIRCUIT THROUGH SAID INSULATIVE STRUCTURE TO SAID SUPPORT STRUCTURE IS ENHANCED.
References Cited (Backward Citations)
US2922067A
Cited
US3300677A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-01-07 | 1972-07-08 | 1973-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-01-07 | 1976-07-08 | 1977-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-01-07 | 1980-07-08 | 1981-01-07 | $7700.00 | Window Closed / Lapsed |