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US3589590A Expired / Lapsed US ⏱️ 0.0 years remaining

Soldering apparatus

Assignee: State Street Bank and Trust Co NA
•
Filing: 1968-12-11
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Granted: 1971-06-29
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Expires: 1988-12-11
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Abstract

Abstract Soldering apparatus comprising a sump for receiving molten solder covered with a layer of oil compound. A fountain is disposed centrally in the sump and forms a chamber having an inlet disposed in the molten solder and an upwardly opening outlet disposed centrally in the sump and elevated above the surface of the oil compound. A pump is provided for pulling molten solder in through the inlet and discharging it out the outlet to form a wave over which, for example, printed circuit boards may be passed to solder a plurality of components thereto and form electrical leads between the components. The pump circulates the molten solder through the fountain and out the outlet at a rate sufficient to cause it to spill downwardly around the fountain to pass through the layer of oil compound and carry a sufficient quantity of such oil compound therewith and into the inlet of the fountain to provide a desired ratio of oil compound to solder in the wave.

Inventors

  • 👤 Robert D Fitzsimmons

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 14:46
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0669; B23K3/0676; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 146 words
Soldering apparatus for producing a standing wave formed by a mixture of a selected ratio of oil compound and molten solder, said apparatus comprising: a sump; molten solder in said sump; a layer of oil compound floating on said solder; fountain means in said sump including a passage having an inlet disposed in said molten solder and an upwardly opening outlet disposed above the surface of said oil compound, said inlet being disposed a sufficient distance below the surface of said oil compound such that pumping of said molten solder and oil compound out said outlet at a predetermined rate will cause the stream of molten solder pouring downwardly from said outlet to agitate said oil compound and intermix therewith sufficiently to produce a mixture of said selected ratio at said inlet; and a pump for pumping said mixture through said passage at said predetermined rate.
Claim 2
Dependent Claim 146 words
Soldering apparatus for producing a standing wave formed by a mixture of a selected ratio of oil compound and molten solder, said apparatus comprising: a sump; molten solder in said sump; a layer of oil compound floating on said solder; fountain means in said sump including a passage having an inlet disposed in said molten solder and an upwardly opening outlet disposed above the surface of said oil compound, said inlet being disposed a sufficient distance below the surface of said oil compound such that pumping of said molten solder and oil compound out said outlet at a predetermined rate will cause the stream of molten solder pouring downwardly from said outlet to agitate said oil compound and intermix therewith sufficiently to produce a mixture of said selected ratio at said inlet; and a pump for pumping said mixture through said passage at said predetermined rate.
Claim 3
Dependent Claim 29 words
Soldering apparatus as set forth in claim 1 that includes: baffles arranged in said outlet to interrupt flow of said mixture and provide a uniform wave above said outlet.
Claim 4
Dependent Claim 25 words
Soldering apparatus as set forth in claim 1, that includes: a heater disposed in heat exchange relationship with said sump for heating said molten solder.
Claim 5
Dependent Claim 39 words
Soldering apparatus as set forth in claim 1 that includes: a plurality of vertically spaced horizontal walls, said walls including perforations for passage of said solder-and-oil compound to interrupt flow thereof and provide a uniform wave above said outlet.
Claim 6
Dependent Claim 33 words
Soldering apparatus as set forth in claim 1 wherein: said pump includes a variable-speed drive means for varying the flow rate of said pump to adjust the ratio of solder to oil compound.

References Cited (Backward Citations)

US2869497A Cited
US3058441A Cited
US3037274A Cited
US2993272A Cited
US3198414A Cited
US3190527A Cited
US3303983A Cited
US3398873A Cited
US3438386A Cited
US3452916A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-06-28 1974-12-28 1975-06-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-06-28 1978-12-28 1979-06-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-06-28 1982-12-28 1983-06-29 $7700.00 Window Closed / Lapsed

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