Abstract A crossover interconnection element for integrated or other microelectronic circuits comprises an arch member of dielectric material, typically ceramic or oxidized silicon, having an array of substantially parallel conductive strips on the underside of the arch and projecting transversely therefrom as self-supporting members. The eight of the arched member and the thickness of the conductive strips are such as to provide clearance, and therefore electrical isolation, between the strips and a conductive pattern on an integrated circuit so that the arched member can be placed on the circuit with the conductive strips transversely disposed and bridging the conductors on the integrated circuit and the projecting terminal portions of the strips are then bonded to conductive members on the circuit board.
The method of fabricating insulated crossover interconnecting elements and mounting same on the surface of a circuit-containing structure having unconnected circuits comprising forming in a slice of semiconductor material an array of channels thereby leaving land portions between said channels, forming on the bottom face of said channels a series of conductive strip patterns, each pattern comprising a plurality of parallel strips each having a thickened termiNal portion, the terminal portions of each adjoining pattern being interdigitated, separating the slice into individual crossover elements by dividing the slice along said land portions, while leaving portions of each land area on each of said elements, removing slice material underlying the terminal portions of the conductive strips thereby leaving same freely extending, and interconnecting said extending terminal portions of certain of the elements with said circuits while abutting said land portions on portions of the said substrate.
Claim 2
Independent Claim
145 words
The method of fabricating insulated crossover interconnecting elements and mounting same on the surface of a circuit-containing structure having unconnected circuits comprising forming in a slice of semiconductor material an array of channels thereby leaving land portions between said channels, forming on the bottom face of said channels a series of conductive strip patterns, each pattern comprising a plurality of parallel strips each having a thickened termiNal portion, the terminal portions of each adjoining pattern being interdigitated, separating the slice into individual crossover elements by dividing the slice along said land portions, while leaving portions of each land area on each of said elements, removing slice material underlying the terminal portions of the conductive strips thereby leaving same freely extending, and interconnecting said extending terminal portions of certain of the elements with said circuits while abutting said land portions on portions of the said substrate.
Claim 3
Dependent Claim
32 words
The method in accordance with claim 1 in which the mounting of said individual crossover element includes pressure bonding the terminal portions of said element to circuit portions of said integrated circuit.