US3601787A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder terminal and spring-wire solder form
Assignee: GTE Automatic Electric Laboratories Inc
•
Filing: 1970-06-22
•
Granted: 1971-08-24
•
Expires: 1990-06-22
Abstract
Abstract A solder form facilitates replacement of receptacle terminals that extend through blind connecting through-holes of a plurality of circuit boards. A hairpin conductor within the solder form spreads apart when the form is melted to carry solder to a replacement terminal and to the conductive surface of a throughhole.
Inventors
- 👤 William A Reimer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:00
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K3/00; H05K3/36; H05K3/368; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K2201/10765; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/04; H05K2203/0415; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
152 words
An interconnecting wiring assembly including a circuit board of the type having conductors on at least one surface thereof and through-holes with conductive surfaces connected to different ones of said conductors, a replacement solder terminal having a solderable portion extending through each of certain ones of said through-holes where required, a spring-wire solder form inserted in said certain through-holes between said solderable portion positioned therein and said conductive surface thereof, said solder form having a hairpin-shaped spring wire substantially enclosed by solder, the spring tension of said spring wire urging the ends thereof outwardly so that in response to application of heat to said form, the end portion of said spring wire moves outwardly to press said solderable portion against a portion of said conductive surface and to carry molten solder to the adjacent portion of said conductive surface of said through-hole and to said solderable portion of said replacement solder terminal.
Claim 2
Dependent Claim
152 words
An interconnecting wiring assembly including a circuit board of the type having conductors on at least one surface thereof and through-holes with conductive surfaces connected to different ones of said conductors, a replacement solder terminal having a solderable portion extending through each of certain ones of said through-holes where required, a spring-wire solder form inserted in said certain through-holes between said solderable portion positioned therein and said conductive surface thereof, said solder form having a hairpin-shaped spring wire substantially enclosed by solder, the spring tension of said spring wire urging the ends thereof outwardly so that in response to application of heat to said form, the end portion of said spring wire moves outwardly to press said solderable portion against a portion of said conductive surface and to carry molten solder to the adjacent portion of said conductive surface of said through-hole and to said solderable portion of said replacement solder terminal.
Claim 3
Dependent Claim
105 words
An interconnecting wiring assembly as claimed in claim 1 including a plurality of parallel circuit boards having aligned through-holes wherein the conductive surface does not extend over a circumferential portion of selected ones of said through-holes, the solderable portion of one of said selected replacement solder terminals being positioned adjacent the nonconductive portions of said selected through-holes, and said spring-wire solder forms including their spring wires having indented portions within said selected through-holes so that when said form is heated, solder does not flow to the conductive portion of said selected through-holes and said spring wire is not in contact with said conductive portions thereof.
Claim 4
Dependent Claim
42 words
A spring-wire solder form comprising a hairpin spring wire tensioned inwardly within a solder form that is adaptable to be inserted in a connecting hole along with solderable conductors and heated to release the spring against said conductors and carry solder thereto.
Claim 5
Dependent Claim
42 words
A spring-wire solder form comprising a hairpin spring wire tensioned inwardly within a solder form that is adaptable to be inserted in a connecting hole along with solderable conductors and heated to release the spring against said conductors and carry solder thereto.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-08-23 | 1975-02-22 | 1975-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-08-23 | 1979-02-22 | 1979-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-08-23 | 1983-02-22 | 1983-08-24 | $7700.00 | Window Closed / Lapsed |