Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
22 words
A strain gauge as set forth in claim 1 wherein each of the electrical leads comprises a metal film of predetermined pattern.
Claim 2
Dependent Claim
18 words
A strain gauge as set forth in claim 1 where the film of organic resin is polyimide resin.
Claim 3
Dependent Claim
25 words
A strain gauge as set forth in claim 1 wherein both the film of organic resin and the coating of organic resin are polyimide resin.
Claim 4
Dependent Claim
40 words
A strain gauge as set forth in claim 1 wherein the film of organic resin has a thickness of about 0.2 to 0.5 mils and wherein the thin film of semiconductor material has a thickness not exceeding about 5,000 angstroms.
Claim 5
Dependent Claim
30 words
A strain gauge as set forth in claim 1 wherein the film of organic resin is deposited on a rigid plate from which the resin film can be easily peeled.
Claim 6
Dependent Claim
15 words
A strain gauge as set forth in claim 6 wherein said plate is alumina ceramic.
Claim 7
Dependent Claim
27 words
A strain gauge assembly as set forth in claim 6 wherein the plate has a surface finish of from about 40 to 60 micro inches (arithmetic average).
Claim 8
Dependent Claim
57 words
A strain gauge assembly comprising an alumina ceramic plate having deposited thereon a film of polyimide resin, said film of polyimide resin having deposited thereon a piezoresistive semiconductor thin film which is of predetermined pattern and which has bonded thereto a plurality of metal film electrical leads, and a coating of polyimide resin over said semiconductor film.
Claim 9
Independent Claim
68 words
A method for manufacturing a strain gauge comprising depositing onto a rigid plate a film of organic resin which can subsequently be easily peeled off of said plate, depositing onto said organic resin film a piezoresistive semiconductor thin film of predetermined pattern, depositing onto said semiconductor thin film a plurality of metal film electrical leads, and thereafter coating the semiconductor thin film with a layer of organic resin.
Claim 10
Dependent Claim
21 words
A method as set forth in claim 10 wherein said plate is alumina ceramic and said resin film is polyimide resin.
Claim 11
Dependent Claim
33 words
A method as set forth in claim 10 wherein said resin film and said resin coating are polyimide resin and wherein said resin film has a thickness of from 0.2 to 0.5 mils.
Claim 12
Dependent Claim
29 words
A method as set forth in claim 10 wherein said plate is alumina ceramic and has a surface finish of from about 30 to 60 micro inches (arithmetic average).
Claim 13
Independent Claim
81 words
A method for simultaneously manufacturing a plurality of strain gauges comprising depositing a film of organic resin onto a plate from which the organic resin film can subsequently be easily peeled, depositing onto each of a plurality of selected surface portions of said organic resin film a piezoresistive semiconductor thin film of predetermined pattern, depositing onto each of said semiconductor films a plurality of metal film electrical leads, and coating each of said semiconductor films with a layer of organic resin.
Claim 14
Dependent Claim
54 words
A method as set forth in claim 14 wherein said plate is scored for subsequent breakage into a plurality of small plates of predetermined size and shape, each of the portions of the organic resin film deposited onto each of said small plates constituting one of said selected portions of said organic resin film.
Claim 15
Dependent Claim
15 words
A method as set forth in claim 15 wherein said resin film is polyimide resin.
Claim 16
Dependent Claim
14 words
A method as set forth in claim 15 wherein said plate is alumina ceramic.