Heated semiconductor bonding tool

Claim 2

A heated bonding tool for the manufacture of semiconductor devices comprising: a heat sink, a first recess in said heat sink for receiving a removable bonding nib therein, means mounted on the heat sink for urging the bonding nib into engagement with the heat sink, a second recess in said heat sink comprising a helical thread for receiving therein in surface to surface contact a removable flexible round wire heating element formed as a helical coil, said second recess being located in close proximity to said first recess in the heat sink, a round wire helical coil heating element formed as a flexible helical coil of greater diameter than the helical threads, said helical coil being radially compressed to conform to the shape and size of the helical threads when installed therein providing a radial force engaging said helical coil heating element in surface of surface compression fit with said helical threads, and a heat choke connected to and extending from said heat sink for limiting heat transfer from the heat sink and mounting the bonding tool to a bonding machine.

Claim 3

A heated bonding tool as set forth in claim 1, wherein the round wire helical coil heating element is tightly held against the helical threads through radial forces exerted by the helical coil acting as a radial spring to provide a compression fit with the heat sink.

Claim 4

A heated bonding tool as set forth in claim 2, wherein the pitch of said helical coil heating element as formed is less than the pitch of the helical thread for providing an axial compression fit and separation of the coils of the heating element.

Claim 5

A heated bonding tool as set forth in claim 1, wherein said first recess comprises an open face groove and said means urging the bonding nib into engagement with the heat sink comprises a nib retainer having a clamp head rotatably mounted on the heat sink for urging the bonding nib into engagement with the heat sink.

Claim 6

A heat bonding tool as set forth in claim 4, wherein said clamp head is urged into engagement with the bonding nib by a coil spring located in a third recess in the heat sink.

Claim 7

A heated bonding tool as set forth in claim 5, wherein said nib retainer further includes a hollow cylinder attached to the clamp head which is slidably and rotatably mounted therewith in the third recess in the heat sink, a flat on the clamp head which is rotatable to a first position wherein the flat is disposed parallel to the axis of the bonding nib and the open face groove to permit loading and unloading of a bonding nib, said flat on the clamp head being rotatable to a second position wherein the flat is disposed transverse to the axis of the bonding nib and the open face groove to permit the clamp head to retain the bonding nib in the first recess of the heat sink.

Claim 8

A heated bonding tool for the manufacture of semiconductor devices comprising: a heat sink comprising an integral block of heat conductive metal, a first recess in said heat sink forming a first interface surface on the heat sink, a bonding nib tightly fitted against said first interface surface, a second recess in said heat sink in close proximity to said first recess forming a second interface surface, said second interface surface comprising a helical thread adapted to accept a removable heating element therein, a cylindrical-shaped flexible round wire helical coil heating element formed as a flexible helical coil of different diameter than the helical thread, said helical coil being radially flexed as a spring to conform to the shape and size of the helical thread when installed therein providing a radial force for engaging said helical coil heating element tightly fitted in surface to surface contact with said helical thread for transmitting heat through the two interface surfaces on the heat sink to the bonding nib, and heat choke means on the heat sink for mounting the bonding tool to a bonding machine.

Claim 9

A heated bonding tool for the manufacture of semiconductor devices comprising: a heat sink comprising an integral block of heat conductive metal, a first recess in said heat sink forming a first interface surface on the heat sink, a bonding nib tightly fitted against said first interface surface, a second recess in said heat sink in close proximity to said first recess forming a second interface surface, said second interface surface comprising a helical thread adapted to accept a removable heating element therein, a cylindrical-shaped flexible round wire helical coil heating element formed as a flexible helical coil of different diameter than the helical thread, said helical coil being radially flexed as a spring to conform to the shape and size of the helical thread when installed therein providing a radial force for engaging said helical coil heating element tightly fitted in surface to surface contact with said helical thread for transmitting heat through the two interface surfaces on the heat sink to the bonding nib, and heat choke means on the heat sink for mounting the bonding tool to a bonding machine.

Claim 10

A heated bonding tool as set forth in claim 7, wherein said helical coil heating element is flexible in a radial direction to permit the heating coil to change its diameter and to be screwed onto the helical thread, and is sufficiently strong as a round wire in tension to permit removal from the helical thread by deforming and unraveling the helical coil heating element.

Claim 11

A heated bonding tool as set forth in claim 7 wherein said helical coil heating element is further provided with a screw end formed as a radial bisector of the end of the coil, said screw end providing means for screwing said coil into said helical thread and simultaneously contracting the diameter of said helical coil.