US3648167A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fluid-cooled apparatus for testing power semiconductor devices
Assignee: RCA Corp
•
Filing: 1970-06-01
•
Granted: 1972-03-07
•
Expires: 1990-06-01
Abstract
Abstract The apparatus includes a base member having an upper surface and a cavity therein, with a channel in the interior which communicates with the cavity. The surface has an aperture communicating with the cavity. A power semiconductor device is held in the aperture with an outer heat transfer surface of the device exposed in the cavity, and a fluid is circulated through the channel and cavity and across the heat transfer surface. A tunable weir in the cavity provides means for controlling the fluid, to minimize the thermal resistance between the heat transfer surface and the fluid.
Inventors
- 👤 Don Ryall Purdy
- 👤 William Edward Donnelly
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 23:56
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06783; G01R31/00; G01R31/26; G01R31/2601; Y; Y10; Y10S; Y10S165/00; Y10S165/903
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
162 words
Apparatus for cooling a power semiconductor device having an outer heat transfer surface, comprising: a. a base member having a major surface and a cavity therein, said surface having an aperture which communicates with said cavity; b. said base member having a channel in the interior of said base member, said channel having an input portion and an output portion each of which communicates with said cavity; c. means for holding said power semiconductor device in said aperture so that said outer heat transfer surface of said device is exposed in said cavity; d. means for circulating a fluid through said cavity and across said heat transfer surface, said circulating means including said input and said output portions; and e. means in said cavity for controlling said circulating fluid so as to minimize the thermal resistance between said heat transfer surface and said circulating fluid, said control means comprising a weir slidably mounted in said input and output portions of said channel.
Claim 2
Dependent Claim
162 words
Apparatus for cooling a power semiconductor device having an outer heat transfer surface, comprising: a. a base member having a major surface and a cavity therein, said surface having an aperture which communicates with said cavity; b. said base member having a channel in the interior of said base member, said channel having an input portion and an output portion each of which communicates with said cavity; c. means for holding said power semiconductor device in said aperture so that said outer heat transfer surface of said device is exposed in said cavity; d. means for circulating a fluid through said cavity and across said heat transfer surface, said circulating means including said input and said output portions; and e. means in said cavity for controlling said circulating fluid so as to minimize the thermal resistance between said heat transfer surface and said circulating fluid, said control means comprising a weir slidably mounted in said input and output portions of said channel.
Claim 3
Dependent Claim
15 words
Apparatus according to claim 1, further including means for tuning said weir in said cavity.
Claim 4
Dependent Claim
28 words
Apparatus according to claim 2, wherein said weir includes a recess which is adapted to receive, in spaced relation, a terminal lead extending from said heat transfer surface.
Claim 5
Dependent Claim
24 words
Apparatus according to claim 2, wherein said weir includes a recess which is adapted to receive a stud extending from said heat transfer surface.
Claim 6
Dependent Claim
26 words
Apparatus according to claim 2, further including a resilient insulating and sealing ring surrounding the periphery of said aperture in said surface of said base member.
Claim 7
Dependent Claim
21 words
Apparatus according to claim 5, wherein said holding means includes spring tensioning means for holding said device against said resilient ring.
Claim 8
Independent Claim
137 words
A method for testing an encapsulated power semiconductor device of the type having an outer heat transfer surface thereon, comprising the steps of: a. providing a base member having a major surface and cavity therein, said surface having an aperture which communicates with said cavity; b. securing said device to said base member, so that said outer heat transfer surface is exposed in said cavity; c. providing a tuneable weir in said cavity and spaced from said heat transfer surface; d. circulating a fluid through said cavity and across said heat transfer surface and said weir; e. tuning said weir to control the flow of said circulating fluid in said cavity, so as to minimize the thermal resistance between said heat transfer surface and said fluid; and f. measuring the electrical and thermal characteristics of said device.
Claim 9
Independent Claim
137 words
A method for testing an encapsulated power semiconductor device of the type having an outer heat transfer surface thereon, comprising the steps of: a. providing a base member having a major surface and cavity therein, said surface having an aperture which communicates with said cavity; b. securing said device to said base member, so that said outer heat transfer surface is exposed in said cavity; c. providing a tuneable weir in said cavity and spaced from said heat transfer surface; d. circulating a fluid through said cavity and across said heat transfer surface and said weir; e. tuning said weir to control the flow of said circulating fluid in said cavity, so as to minimize the thermal resistance between said heat transfer surface and said fluid; and f. measuring the electrical and thermal characteristics of said device.
References Cited (Backward Citations)
US2942165A
Cited
US3118071A
Cited
US2992372A
Cited
US3204157A
Cited
US3389305A
Cited
US3400543A
Cited
US3524497A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-03-07 | 1975-09-06 | 1976-03-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-03-07 | 1979-09-06 | 1980-03-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-03-07 | 1983-09-06 | 1984-03-07 | $7700.00 | Window Closed / Lapsed |