Method of metallizing devices
Abstract
Abstract IN THE FABRICATION OF DEVICES, AS, FOR EXAMPLE, SEMICONDUCTOR DEVICES OF THE BEAM LEAD TYPE, ONE TECHNIQUE EMPLOYED TO METALLIZE ELECTRODE SURFACES IS TO ELECTRODEPOSIT A LAYER OF GOLD ONTO A PREVIOUSLY DEPOSITED LAYER OF PLATINUM, WHICH IN TURN HAS BEEN DEPOSITED ON A LAYER OF TITANIUM. A PHOTERESIST LAYER, DEPOSITED DIRECTLY ON THE PLATINUM LAYER, IS USED TO DEFINES REGIONS TO BE GOLD PLATED TO FORM ELECTRODE CONTACTS AND INTERCONNECTIVE PATTERNS. OXIDATION, PREFERABLY BY ANODIZING, OF THE PLATINUM LAYER PRIOR TO THE DEPOSITION OF THE PHOTORESIST LAYER INCREASE THE ADHERENCE OF THE PHOTORESIST LAYER. THE INCREASED ADHERENCE SIGNIFICANTLY REDUCES UNDERPLATING OF THE PHOTORESIST LAYER DURING THE ELECTRODEPOSITION OF THE GOLD LAYER AND RESULTS IN IMPROVED DEFINITION OF THE GOLD ELECTRODE SURFACE.
Inventors
- 👤 Kenneth Russ Newby
- 👤 Dennis Robert Turner
Bibliographic Details
Claims Analysis
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