Patent US2089548A successfully refreshed from Google Patents.
US3710196A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board and method of making circuit connections
Assignee: Individual
•
Filing: 1970-04-27
•
Granted: 1973-01-09
•
Expires: 1990-04-27
Abstract
Abstract The top surface of a circuit board made of a dielectric material is provided with a plurality of recesses filled with mercury or a low melting point conductive alloy. The alloy is solid at room temperature and reduced to a plastic or flow condition at a temperature below the damaging temperature of the board. The board is heated to maintain the low melting point alloy in its liquid state and the component leads of the electronic and other electrical components appropriately bent to extend into the alloy. The board is then cooled such that the solder solidifies to support the components and simultaneously establish the circuit connections.
Inventors
- 👤 T Fifield
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/101; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K7/00; H05K7/02; H05K7/06; H05K1/00; H05K1/02; H05K1/09; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2203/00; H05K2203/04; H05K2203/0475; H05K2203/12; H05K2203/128; H05K2203/14; H05K2203/1461; H05K2203/1469; H05K2203/15; H05K2203/1581; H05K3/107; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
60 words
The circuit board apparatus of claim 1 wherein said board is a solid board having parallel top and bottom planar surfaces with said recesses formed in the upper one of said planar surfaces, the thickness of said board being selected to establish rapid transfer of heat from the second of said surfaces to said recesses for heating said conductive medium.
Claim 2
Dependent Claim
33 words
The circuit board apparatus of claim 2 wherein said recesses include a pair of parallel grooves extending the length of the board with the conductive medium defining a pair of common bus bars.
Claim 3
Dependent Claim
15 words
The board apparatus of claim 1 wherein said medium is a low melting point alloy.
Claim 4
Dependent Claim
18 words
The board apparatus of claim 1 wherein selected recesses include small wells in the bottom receiving the conductors.
Claim 5
Dependent Claim
60 words
The circuit board apparatus of claim 1 wherein said circuit board is a solid and flat plate having said plurality of recesses in one of the flat walls, said circuit board being adapted to have a selected normal operating temperature, said conductive medium consisting of a low melting point alloy which solidifies at a temperature below said normal operating temperature.
Claim 6
Dependent Claim
28 words
The circuit board apparatus of claim 1 wherein said circuit board is a molded member having a bottom wall generally conforming to The bottom configuration of the recesses.
References Cited (Backward Citations)
FR1143246A
Cited
US3040213A
Cited
US3214827A
Cited
US3316619A
Cited
US3396894A
Cited
US3541222A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-01-09 | 1976-07-10 | 1977-01-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-01-09 | 1980-07-10 | 1981-01-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-01-09 | 1984-07-10 | 1985-01-09 | $7700.00 | Window Closed / Lapsed |