US3713575A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding apparatus having means for continuous monitoring of the bond
Assignee: AT&T Inc
•
Filing: 1971-06-29
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Granted: 1973-01-30
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Expires: 1991-06-29
Abstract
Abstract Bonding apparatus is disclosed in which a housing and ram are combined with a transparent pressure plate, a transparent device carrier and an optical arrangement for continuously monitoring the parts during the bonding operation.
Inventors
- 👤 R Cushman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 19:38
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; B23K20/26; H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/07188; H10W72/072; H10W72/07231; H10W72/07232; H10W72/073; H10W72/07331; H10W72/07336; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49764; Y10T29/49769
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
182 words
In apparatus for simultaneously bonding the leads on the front surface of a miniature circuit device to lands located on the front surface of a circuit device support, the combination comprising: housing means for locating the lands on the front surface of said circuit device support in face-to-face relationship with the leaDs located on the front surface of said circuit device; ram means for simultaneously applying heat and pressure to the back surface of said circuit device support when said leads and lands are in contact with each other, said ram means being mounted for reciprocal movement in said housing; a transparent plate for resisting pressure exerted by said ram means, said transparent plate being fixedly mounted in said housing in register with said ram means; and carrier means for locating the leads on said circuit device in contact with the lands on the front surface of said circuit device support when said ram means applies heat and pressure thereto, said carrier means being transparent whereby alignment between the leads and lands can be observed at all times during the bonding operation.
Claim 2
Dependent Claim
182 words
In apparatus for simultaneously bonding the leads on the front surface of a miniature circuit device to lands located on the front surface of a circuit device support, the combination comprising: housing means for locating the lands on the front surface of said circuit device support in face-to-face relationship with the leaDs located on the front surface of said circuit device; ram means for simultaneously applying heat and pressure to the back surface of said circuit device support when said leads and lands are in contact with each other, said ram means being mounted for reciprocal movement in said housing; a transparent plate for resisting pressure exerted by said ram means, said transparent plate being fixedly mounted in said housing in register with said ram means; and carrier means for locating the leads on said circuit device in contact with the lands on the front surface of said circuit device support when said ram means applies heat and pressure thereto, said carrier means being transparent whereby alignment between the leads and lands can be observed at all times during the bonding operation.
Claim 3
Dependent Claim
182 words
In apparatus for simultaneously bonding the leads on the front surface of a miniature circuit device to lands located on the front surface of a circuit device support, the combination comprising: housing means for locating the lands on the front surface of said circuit device support in face-to-face relationship with the leaDs located on the front surface of said circuit device; ram means for simultaneously applying heat and pressure to the back surface of said circuit device support when said leads and lands are in contact with each other, said ram means being mounted for reciprocal movement in said housing; a transparent plate for resisting pressure exerted by said ram means, said transparent plate being fixedly mounted in said housing in register with said ram means; and carrier means for locating the leads on said circuit device in contact with the lands on the front surface of said circuit device support when said ram means applies heat and pressure thereto, said carrier means being transparent whereby alignment between the leads and lands can be observed at all times during the bonding operation.
Claim 4
Dependent Claim
182 words
In apparatus for simultaneously bonding the leads on the front surface of a miniature circuit device to lands located on the front surface of a circuit device support, the combination comprising: housing means for locating the lands on the front surface of said circuit device support in face-to-face relationship with the leaDs located on the front surface of said circuit device; ram means for simultaneously applying heat and pressure to the back surface of said circuit device support when said leads and lands are in contact with each other, said ram means being mounted for reciprocal movement in said housing; a transparent plate for resisting pressure exerted by said ram means, said transparent plate being fixedly mounted in said housing in register with said ram means; and carrier means for locating the leads on said circuit device in contact with the lands on the front surface of said circuit device support when said ram means applies heat and pressure thereto, said carrier means being transparent whereby alignment between the leads and lands can be observed at all times during the bonding operation.
Claim 5
Dependent Claim
21 words
The combination in accordance with claim 1 wherein a portion of said carrier means is a fluid during the bonding process.
Claim 6
Dependent Claim
17 words
The combination in accordance with claim 1 wherein said carrier means is made of a plastic material.
Claim 7
Dependent Claim
30 words
The combination in accordance with claim 3 wherein said carrier means comprises an elongated strip of plastic extending through said housing means and includes indented portions for receiving circuit devices.
Claim 8
Dependent Claim
15 words
The combination in accordance with claim 1 wherein said transparent plate is made of quartz.
Claim 9
Dependent Claim
19 words
The combination in accordance with claim 1 wherein said carrier means is an integral part of said transparent plate.
Claim 10
Dependent Claim
26 words
The combination in accordance with claim 1 further including observing means for monitoring the relationship between said leads and lands during and before the bonding operation.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-01-30 | 1976-07-31 | 1977-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-01-30 | 1980-07-31 | 1981-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-01-30 | 1984-07-31 | 1985-01-30 | $7700.00 | Window Closed / Lapsed |