US3715797A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for solder removal
Assignee: Wik-It Electronics Corp
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Filing: 1970-10-23
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Granted: 1973-02-13
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Expires: 1990-10-23
Abstract
Abstract A rope-like member of braided heat conducting metallic wires coated with a second metal and a flux is applied to a solid solder joint. Heat applied to the rope-like member liquifies the solder which in turn is absorbed into the member thereby removing solder from the joint.
Inventors
- 👤 S Beattie
- 👤 T Jackson
- 👤 D Weltsch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 13:13
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/018; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
85 words
Method for removing solder from a solid soldered joint comprising: a. contacting the solid solder at said joint with a wick of heat conducting metal wires coated with a flux; b. applying heat to said solid solder for a time sufficient to liquify the same; c. maintaining said contact between said wick and the liquified solder for a time sufficient to allow the liquefied solder to be drawn into said wick by capillary action; and d. removing said heat and said wick from said joint.
Claim 2
Dependent Claim
85 words
Method for removing solder from a solid soldered joint comprising: a. contacting the solid solder at said joint with a wick of heat conducting metal wires coated with a flux; b. applying heat to said solid solder for a time sufficient to liquify the same; c. maintaining said contact between said wick and the liquified solder for a time sufficient to allow the liquefied solder to be drawn into said wick by capillary action; and d. removing said heat and said wick from said joint.
Claim 3
Dependent Claim
85 words
Method for removing solder from a solid soldered joint comprising: a. contacting the solid solder at said joint with a wick of heat conducting metal wires coated with a flux; b. applying heat to said solid solder for a time sufficient to liquify the same; c. maintaining said contact between said wick and the liquified solder for a time sufficient to allow the liquefied solder to be drawn into said wick by capillary action; and d. removing said heat and said wick from said joint.
Claim 4
Dependent Claim
85 words
Method for removing solder from a solid soldered joint comprising: a. contacting the solid solder at said joint with a wick of heat conducting metal wires coated with a flux; b. applying heat to said solid solder for a time sufficient to liquify the same; c. maintaining said contact between said wick and the liquified solder for a time sufficient to allow the liquefied solder to be drawn into said wick by capillary action; and d. removing said heat and said wick from said joint.
Claim 5
Dependent Claim
18 words
The method of claim 1 wherein: e. said wires have an intermediate coating of a corrosion resistant material.
Claim 6
Dependent Claim
23 words
The method of claim 1 wherein: e. said heat is applied to said wick and conducted thereby to the solder at said joint.
References Cited (Backward Citations)
US3371249A
Cited
US3627191A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-13 | 1976-08-14 | 1977-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-13 | 1980-08-14 | 1981-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-13 | 1984-08-14 | 1985-02-13 | $7700.00 | Window Closed / Lapsed |