Oxidic solder sealing compositions and their use in forming laminates
Abstract
Abstract An oxidic solder sealing composition is provided which is suitable for selectively joining relatively high expansion glasses, ceramics and metals to each other and in combination. The solder compositions comprise a binary admixture of vanadium pentoxide, V2O5, and silver oxide, Ag2O, in the mole ratio ranging from 0.3 to 3.5 Ag2O:1.0 V2O5, and more particularly in the molar ratio of 0.5 to 3.0 Ag2O:1.0 V2O5. These solder compositions may be used in the form of rods, frit or powder, paste with conventional fugitive binders or solvents or as an aqueous suspension, such as in concentrated ammonia. In preparing these compositions, AgNO3 is mixed with finely divided V2O5 and then the two components are fused together. Subsequently, the fused mass is cooled and thereafter may be ground into a powder. Laminates and sealed surfaces are prepared from the binary solder compositions.
Inventors
- 👤 T Chvatal
Bibliographic Details
Claims Analysis
Total Claims: 12References Cited (Backward Citations)
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