Process for electroless plating

Claim 2

A process as claimed in claim 1 in which an oxidizing agent for cuprous ion is present.

Claim 3

A process as claimed in claim 2 in which the oxidizing agent is oxygen.

Claim 4

In a process for electroless copper plating which comprises immersing a surface which is receptive of electroless deposition of copper in an alkaline aqueous bath containing a water soluble cupric salt, a complexing agent for cupric ions, an alkaline metal hydroxide for maintaining solution pH between about 11.5 and 14, and a reducing agent for cupric ions, the improvement which comprises the use of a stabilizing amount of at least one organo-nitrogen compound selected from the group consisting of benzotriazole, creatinine, creatine, guanidine, imidazole, benzotriazine, aminoguanidine, 3 amino-(1H)-1,2,4 triazole, diphenyl guanidine, melamine and benzoguanamine, the organo-nitrogen compound being present in an amount sufficient to stabilize the bath against decomposition due to the presence of at least palladium ion but insufficient to terminate copper deposition.

Claim 5

A process as claimed in claim 5 in which an oxidizing agent for cuprous ion is present.

Claim 6

A process as claimed in claim 6 in which the oxidizing agent is oxygen.

Claim 7

In an aqueous alkaline electroless copper plating solution comprising a soluble cupric salt, a complexing agent for cupric ion; an alkali metal hydroxide to maintain solution pH between about 11.5 and 14, a reducing agent for cupric ion and a source of oxygen to oxidize cuprous ions back to the cupric state, improvement comprising at least one organo-nitrogen compound conTaining a group selected from the groups consisting of

Claim 8

In an alkaline electroless copper plating solution comprising a soluble cupric salt; a complexing agent for cupric ions; an alkali metal hydroxide for pH control and a reducing agent for cupric ions, the improvement comprising an amount of benzotriazole sufficient to stabilize the solution against decomposition due to the presence of at least palladium ion but insufficient to terminate copper deposition onto a surface receptive to copper deposition.

Claim 9

In an aqueous alkaline electroless copper plating solution consisting of water, a soluble cupric salt, a complexing agent for cupric ion, an alkali metal hydroxide to maintain solution pH between about 11.5 and 14, a reducing agent for cupric ion and a source of oxygen to oxidize cupric ions back to the cupric state, the improvement comprising at least one stabilizer selected from the group consisting of benzotriazole, creatinine, creatine, guanidine, imidazole, benzotriazine, aminoguanidine, 3 amino-(1H)-1,2,4 triazole, diphenylguanidine, melamine and benzoguanamine present in solution in an amount sufficient to stabilize the solution against decomposition due to the presence of at least palladium ion but insufficient to prevent deposition of copper onto a surface receptive to copper deposition.