Semiconductor circuit element with pressure contact means

Claim 1

A semiconductor circuit element with pressure contact means, comprising a wafer semiconductor body having at least one pnjunction and two outwardly facing surfaces, said pressure contact means comprising two pressure contact elements for clamping said semiconductor body therebetween, said contact elements being arranged symmetrically on opposite facing surfaces of said body, and a single separate ductile electrode interposed between each outwardly facing surface of the semiconductor body and the respective pressure contact element, said pressure contact elements having identical inwardly facing surfaces facing the respective outwardly facing surface of the semiconductor body and disposed symmetrically toward the respective semiconductor body surface, said identical inwardly facing surfaces providing pressure areas arranged symmetrically relative to a center line of the circuit element, said ductile electrodes having a dished shape with an up-turned rim surrounding an inner, outwardly facing bottom, each bottom having a diameter corresponding to that of the respective one of said pressure contact elements so that the radial position of the respective pressure contact element inside said rim is automatically fixed and centered relative to the corresponding ductile electrode, and resilient adhesive holding means between the edges of said ductile electrodes and the edges of said body for symmetrically holding said ductile electrodes on said outwardly facing surfaces of said semiconductor body, whereby the position of the respective contact elements is automatically centered.