High density digital systems and their method of fabrication with liquid cooling for semi-conductor circuit chips

Claim 2

A high density interconnection and packaging arrangement for complex digital systems comprising in combination: a. a plurality of logic cards each logic card including a multiplicity of unpackaged semiconductor integrated circuit chips mounted directly on a major surface thereof; b. a multi-layer interconnection board having a plurality of interconnection layers for interconnecting said logic cards being mounted on said multi-layer interconnection board; and, c. a package including a liquid cooling system, said plurality of logic cards mounted on said multi-layer interconnection board being immersed in a liquid coolant within said package.

Claim 3

The interconnection and packaging arrangement according to claim 1 wherein said logic cards include interconnection patterns on at least said major surface for interconnecting said unpackaged semiconductor integrated circuit elements and beam leads connecting said unpackaged semiconductor integrated circuit elements to said interconnection patterns.

Claim 4

The interconnection and packaging arrangement according to claim 1 wherein the logic cards include interconnection patterns on at least said one major surface and said unpackaged semiconductor integrated circuit elements are solder bonded to said interconnection patterns.

Claim 5

The interconnection and packaging arrangement according to claim 1 wherein the logic cards include interconnection patterns on at least one major surface thereof for providing interconnections to said unpackaged semiconductor integrated circuit elements and said unpackaged semiconductor integrated circuit elements are connected to said interconnection patterns by means of intermediary interconnection patterns formed on flexible polyimide film.

Claim 6

The interconnection and packaging arrangement according to claim 1 including sockets mounted on said multi-layer interconnection boards, each of said sockets adapted to accept one of said logic cards and provide interconnections between said logic cards and said multi-layer interconnection board.

Claim 7

The interconnection and packaging arrangement according to claim 5 wherein said sockets include a plurality of spring contacts which make electrical contact with terminal contacts on said logic cards, said spring contacts being individually mounted directly to interconnection pads on said multi-layer interconnection boards.

Claim 8

The interconnection and packaging arrangement according to claim 5 wherein said logic cards include edge conductors, at least one such edge conductor being on either end of each of said logic cards for providing operating voltages to the unpackaged semiconductor integrated circuit elements mounted on the logic card, and wherein said sockets include corresponding channels on either end thereof including conductor strips which are adapted to make electrical contact with the edge conductors of said logic cards.

Claim 9

The interconnection and packaging arrangement according to claim 7 including a spring lock within the channels of said sockets, said spring lock being operable by a rotatable cam for locking said logic card into said socket and ensuring electrical contact between said edge conductors on said logic card and the conductors within said channels.

Claim 10

The interconnection and packaging arrangement according to claim 1 wherein said liquid coolant is a florocarbon.

Claim 11

The interconnection and packaging arrangement according to claim 1 wherein said liquid cooling system includes a plurality of liquids, a first liquid in which said logic cards and multi-layer interconnection board are immersed and a second liquid contiguous with said first liquid for exchanging heat from said first liquid through a heat exchanger.

Claim 12

The interconnection and packaging arrangement according to claim 1 wherein the logic cards include at least three levels of interconnections, a first level providing interconnections mainly in the x direction, a second level providing interconnections mainly in the y direction and a third level providing the necessary operating voltages for the semiconductor integrated circuits.

Claim 13

The interconnection and packaging arrangement according to claim 11 including feedthrough conductors in said logic cards coupling interconnections in said first level with interconnections in said second level.

Claim 14

A high density interconnection and packaging arrangement for complex digital systems comprising in combination: a. a plurality of logic cards, each including i. a multiplicity of closely spaced unpackaged semiconductor integrated circuit chips mounted directly thereon, and ii. at least one level of interconnections interconnecting the integrated circuit chips on said logic cards, the spacing between said semiconductor integrated chips being sufficiently small that the interconnections between said integrated circuit chips are essentially nontransmission lines; b. a multi-layer interconnection board upon which said plurality of logic cards are mounted in close proximity, the multi-layer interconnection board having a plurality of levels of interconnections and providing the interconnections between said logic cards with the spacing between said logic cards being sufficiently small that the interconnections between said logic cards are essentially nontransmission lines; and, c. a package including a liquid cooling system having a liquid coolant in which the logic cards mounted on the interconnection board are immersed.

Claim 15

A high density interconnection and packaging arrangement for complex digital systems comprising in combination: a. a plurality of logic cards, each including i. a multiplicity of closely spaced unpackaged semiconductor integrated circuit chips mounted directly thereon, and ii. at least one level of interconnections interconnecting the integrated circuit chips on said logic cards, the spacing between said semiconductor integrated chips being sufficiently small that the interconnections between said integrated circuit chips are essentially nontransmission lines; b. a multi-layer interconnection board upon which said plurality of logic cards are mounted in close proximity, the multi-layer interconnection board having a plurality of levels of interconnections and providing the interconnections between said logic cards with the spacing between said logic cards being sufficiently small that the interconnections between said logic cards are essentially nontransmission lines; and, c. a package including a liquid cooling system having a liquid coolant in which the logic cards mounted on the interconnection board are immersed.

Claim 16

The interconnection and packaging arrangement according to claim 13 wherein said logic cards include interconnection patterns on at least said major surface for interconnecting said unpackaged semiconductor integrated circuit elements and beam leads connecting said unpackaged semiconductor integrated circuit elements to said interconnection patterns.

Claim 17

The interconnection and packaging arrangement according to claim 13 including sockets mounted on said multilayer interconnection boards, each of said sockets adapted to accept one of said logic cards and provide interconnections between said logic cards and said multi-layer interconnection board.

Claim 18

The interconnection and packaging arrangement according to claim 13 wherein said sockets include a plurality of spring contacts which make electrical contact with terminal contacts on said logic cards, said spring contacts being individually mounted directly to interconnection pads on said multi-layer interconnection boards.

Claim 19

The interconnection and packaging arrangement according to claim 13 wherein said logic cards include edge conductors, at least one such edge conductor being on either end of each of said logic cards for providing operating voltages to the unpackaged semiconductor integrated circuit elements mounted on the logic card, and wherein said sockets include corresponding channels on either end thereof including conductor strips which are adapted to make electrical contact with the edge conductors of said logic cards.

Claim 20

The interconnection and packaging arrangement according to claim 13 wherein said liquid coolant is a florocarbon.

Claim 21

The interconnection and packaging arrangement according to claim 13 wherein said liquid cooling system includes a plurality of liquids, a first liquid in which said logic cards and multi-layer interconnection board are immersed and a second liquid contiguous with said first liquid for exchanging heat from said first liquid through a heat exchanger.

Claim 22

The interconnection and packaging arrangement according to claim 13 wherein the logic cards include at least three levels of interconnections, a first level providing interconnections mainly in the x direction, a second level providing interconnections mainly in the y direction and a third level providing the necessary operating voltages for the semiconductor integrated circuits.

Claim 25

The method according to claim 21 including mounting said plurality of said logic cards on said one or more multi-layer interconnection boards with sockets adapted therefore by mounting individual spring contacts directly to contacts on said interconnection board, mounting said socket over said spring contacts and inserting said logic cards in said sockets to make electrical contact between said spring contacts and interconnection terminals on said logic cards.

Claim 26

An interconnection arrangement for mounting a plurality of logic cards comprising: a. (A) a plurality of logic cards, each logic card including a plurality of circuit elements mounted on a major surface thereof, a plurality of interconnection terminal contacts on said major surface extending to a first edge thereof opposite a second edge one or more voltage planes, and a plurality of edge conductors providing contact to said one or more voltage planes (on said logic cards), at least one such edge conductor being on third and fourth opposite edges of said logic cards, and essentially extending along the entire respective edge; and b. a plurality of sockets (adapted to accept) accepting said logic cards, said sockets including a plurality of spring contacts removably connected to said edge conductors and a plurality of channels including conductor strips within (with) said channels which (are adapted to) conductor strips make electrical contact with the edge conductors of said logic cards.

Claim 27

An interconnection arrangement for mounting a plurality of logic cards comprising: a. (A) a plurality of logic cards, each logic card including a plurality of circuit elements mounted on a major surface thereof, a plurality of interconnection terminal contacts on said major surface extending to a first edge thereof opposite a second edge one or more voltage planes, and a plurality of edge conductors providing contact to said one or more voltage planes (on said logic cards), at least one such edge conductor being on third and fourth opposite edges of said logic cards, and essentially extending along the entire respective edge; and b. a plurality of sockets (adapted to accept) accepting said logic cards, said sockets including a plurality of spring contacts removably connected to said edge conductors and a plurality of channels including conductor strips within (with) said channels which (are adapted to) conductor strips make electrical contact with the edge conductors of said logic cards.

Claim 28

The interconnection arrangement according to claim 23 wherein said sockets are mounted on a multi-layer interconnection board.

Claim 29

The interconnection arrangement according to claim 24 wherein said spring contacts are individually mounted directly to interconnection pads on said multi-layer interconnection boards and the portion of said sockets including said channels is mounted over said spring contacts and extends therethrough to make contact with said terminal contacts to logic cards inserted in said channels.