Thiol-diene adducts as epoxy resin curing agents
Abstract
Abstract 1. PROCESS OF CURING A POLYEPOXIDE HAVING AN AVERAGE OF MORE THANONE 1,2-EPOXALKYL GROUPS PER MOLECULE, WHICH IS CURABLE TO OBTAIN AN EPOXY RESIN, WHICH COMPRISES (A) MIXING FROM ABOUT 0.95 EQUIVALENTS TO ABOUT 0.20 EQUIVALENTS OF A COMPOUND OF THE FORMULA H-(S-(CH2)(1-2)-CH(-R")-S-CYCLOHEXYLENE-CH(-R)-CH(-R''))N- S-(CH2)(1-2)-CH(-R")-SH WHEREIN N IS 1-5, ONE OF R AND R'' IS HYDROGEN AND THE OTHER IS HYDROGEN OR METHYL AND R" IS HYDROGEN OR METHYL WITH THE AVERAGE MOLECULAR WEIGHT OF PRODUCT NOT ABOVE ABOUT 700 WITH FROM ABOUT 0.05 EQUIVALENTS TO ABOUT 0.80 EQUIVALENTS OF AN AMINE OR AMIDE EPOXY CURING AGENT OF FUNCTIONALITY GREATER THAN 2, AND (B) COMBINING THE MIXTURE OF WITH A POLYEPOXIDE HAVING AN AVERAGE OF MORE THAN ONE 1,2-EPOXYALKYL GROUPS PER MOLECULE THAT IS CURABLE TO OBTAIN AN EPOXY RESIN, THE MIXTURE BEING IN PROPORTION SUCH THAT FROM ABOUT 0.75 TO ABOUT 1.25 EQUIVALENTS OF THE MIXTURE OF A IS PROVIDED PER EQUIVALENT OF THE POLYEPOXIDE AND (C) THEREAFTER MAINTAINING THE RESULTING MIXTURE AT AN EPOXY CURING TEMPERATURE FOR A CURING INTERVAL OF TIME.
Inventors
- 👤 R Hickner
- 👤 E Goss
Bibliographic Details
Claims Analysis
Total Claims: 2References Cited (Backward Citations)
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