Abstract 1. AN AQUEOUS FOR ELECTRODEPOSITING BRIGHT COPPER FROM AQUEOUS ACIDIC BATHS COMPRISING BUFFING A METAL SURFACE; IMMERSING SAID PRETREATED METAL SURFACE IN ORGANIC SOLVENT; THEN ELECTROLYTICALLY CLEANING SAID SURFACE IN AN ALKALINE SOLUTION, RISING SAID SURFACE, IMMERSING SAID SURFACE IN ACID, RINSING SAID SURFACE THEREBY OBTAINING A BRIGHT, CLEAN METAL SURFACE; DEPOSITING ON SAID SURFACE A COATING OF COPPER FROM SOLUTION CONTAINING: 0.01 GRAMS PEER LITER TO 10 GRAMS PER LITER OF CUSO4.5H2O; 0.1 GRAMS PER LITER TO 500 GRAMS PER LITER OF NONOXIDIZING ACID; AND 0.1 GRAMS PER LITER TO 100 GRAMS PER LITER OF A POLYETHER CONTAINING AT LEAST 5 ETHER OXYGEN ATOMS PER MOLECULE; AND ELECTRODEPOSITING ON SAID STRIKE COATING A RELATIVELY THICKER LAYER OF BRIGHT, STRONGLY LEVELED, DUCTILE COPPER FROM A COPPER PLATING BATH.
AN AQUEOUS FOR ELECTRODEPOSITING BRIGHT COPPER FROM AQUEOUS ACIDIC BATHS COMPRISING BUFFING A METAL SURFACE; IMMERSING SAID PRETREATED METAL SURFACE IN ORGANIC SOLVENT; THEN ELECTROLYTICALLY CLEANING SAID SURFACE IN AN ALKALINE SOLUTION, RISING SAID SURFACE, IMMERSING SAID SURFACE IN ACID, RINSING SAID SURFACE THEREBY OBTAINING A BRIGHT, CLEAN METAL SURFACE; DEPOSITING ON SAID SURFACE A COATING OF COPPER FROM SOLUTION CONTAINING: 0.01 GRAMS PEER LITER TO 10 GRAMS PER LITER OF CUSO4.5H2O; 0.1 GRAMS PER LITER TO 500 GRAMS PER LITER OF NONOXIDIZING ACID; AND 0.1 GRAMS PER LITER TO 100 GRAMS PER LITER OF A POLYETHER CONTAINING AT LEAST 5 ETHER OXYGEN ATOMS PER MOLECULE; AND ELECTRODEPOSITING ON SAID STRIKE COATING A RELATIVELY THICKER LAYER OF BRIGHT, STRONGLY LEVELED, DUCTILE COPPER FROM A COPPER PLATING BATH.
Claim 2
Dependent Claim
127 words
AN AQUEOUS FOR ELECTRODEPOSITING BRIGHT COPPER FROM AQUEOUS ACIDIC BATHS COMPRISING BUFFING A METAL SURFACE; IMMERSING SAID PRETREATED METAL SURFACE IN ORGANIC SOLVENT; THEN ELECTROLYTICALLY CLEANING SAID SURFACE IN AN ALKALINE SOLUTION, RISING SAID SURFACE, IMMERSING SAID SURFACE IN ACID, RINSING SAID SURFACE THEREBY OBTAINING A BRIGHT, CLEAN METAL SURFACE; DEPOSITING ON SAID SURFACE A COATING OF COPPER FROM SOLUTION CONTAINING: 0.01 GRAMS PEER LITER TO 10 GRAMS PER LITER OF CUSO4.5H2O; 0.1 GRAMS PER LITER TO 500 GRAMS PER LITER OF NONOXIDIZING ACID; AND 0.1 GRAMS PER LITER TO 100 GRAMS PER LITER OF A POLYETHER CONTAINING AT LEAST 5 ETHER OXYGEN ATOMS PER MOLECULE; AND ELECTRODEPOSITING ON SAID STRIKE COATING A RELATIVELY THICKER LAYER OF BRIGHT, STRONGLY LEVELED, DUCTILE COPPER FROM A COPPER PLATING BATH.