US3843911A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Continuous film transistor fabrication process
Assignee: Texas Instruments Inc
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Filing: 1969-12-24
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Granted: 1974-10-22
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Expires: 1989-12-24
Abstract
Abstract A continuous film transistor fabrication process utilizes a roll of polyimide substrate film on which a plurality of groups of three metal contacts is patterned. The edges of the film are turned under, including portions of the metal contacts, to facilitate the ohmic bonding of the substrate contacts to other respective contacts on a support member. Holes are formed in the film between each pattern to act as indexing means for feeding the film through a series of processing stations. As the film passes through each station, a separate step in the fabrication takes place, until the completed, tested, and sorted transistors are removed from the last station.
Inventors
- 👤 A Horton
- 👤 C Lightfoot
- 👤 R Hanneman
- 👤 J Brantley
- 👤 P Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 22:01
CPC Classifications
H; H10; H10W; H10W99/00; H10W70/00; H10W70/40; H10W70/481; H10W70/60; H10W70/62; H10W70/65; H10W70/658; H10W95/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/12833; Y10T428/12861; Y10T428/12868; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
120 words
A roll of substrate film comprised of: a. a polymer film having two major surfaces coiled into a roll; b. a plurality of groups of electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned-under edges to provide upper and lower portions of said one surface; c. each contact extending on said upper and the lower portions of said one surface of the substrate film for facilitating the ohmic connection of a portion of each contact to another metal contact on a support member; and d. indexing means formed in the polymer film between each contact pattern for the continuous feeding of the roll of substrate film through a series of processing stations.
Claim 2
Dependent Claim
120 words
A roll of substrate film comprised of: a. a polymer film having two major surfaces coiled into a roll; b. a plurality of groups of electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned-under edges to provide upper and lower portions of said one surface; c. each contact extending on said upper and the lower portions of said one surface of the substrate film for facilitating the ohmic connection of a portion of each contact to another metal contact on a support member; and d. indexing means formed in the polymer film between each contact pattern for the continuous feeding of the roll of substrate film through a series of processing stations.
Claim 3
Dependent Claim
64 words
The roll of substrate film of claim 1, wherein said electrically conductive contact patterns adhered to said one surface of said polyimide film are comprised of: a. a first layer of copper adhered to said one surface; b. a second layer of a protective material bonded to said first layer; and c. a third layer of a noble metal bonded to said second layer.
Claim 4
Dependent Claim
125 words
A roll of transistor substrate film comprised of: a. a polymer film having two major surfaces coiled into a roll; b. a plurality of groups of three electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned-under edges to provide upper and lower portions of said one surface; c. each contact pattern extending on said upper and the lower portions of said one surface of the substrate film for facilitating the ohmic connection of a portion of each contact to a metal contact on a support member; and d. indexing means formed in the polymer film between each group of contact patterns for the continuous feeding of the roll of substrate film through a series of processing stations.
Claim 5
Dependent Claim
125 words
A roll of transistor substrate film comprised of: a. a polymer film having two major surfaces coiled into a roll; b. a plurality of groups of three electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned-under edges to provide upper and lower portions of said one surface; c. each contact pattern extending on said upper and the lower portions of said one surface of the substrate film for facilitating the ohmic connection of a portion of each contact to a metal contact on a support member; and d. indexing means formed in the polymer film between each group of contact patterns for the continuous feeding of the roll of substrate film through a series of processing stations.
Claim 6
Dependent Claim
63 words
The roll of transistor substrate film of claim 3, wherein said electrically conductive contact patterns adhered to one surface of said polyimide film are comprised of: a. a first layer of copper adhered to said one surface; b. a second layer of a protective material bonded to said first layer; c. a third layer of a noble metal bonded to said second layer.
Claim 7
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the first layer of protective material is nickel.
Claim 8
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the first layer of protective material is molybdenum.
Claim 9
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the first layer of protective material is chromium.
Claim 10
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the second layer of noble metal is silver.
Claim 11
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the second layer of noble metal is gold.
Claim 12
Dependent Claim
18 words
The roll of transistor substrate film of claim 4, wherein the second layer of noble metal is platinum.
Claim 13
Dependent Claim
93 words
The roll of transistor substrate film of claim 4, including a. a back-side collector contact transistor chip alloyed to one contact of each group of contact patterns on said one surface, said chip having contacts to base and emitter regions; b. a first wire bonded to the contacts of said base regions and a second contact of each group of contacts patterned on said one surface; and c. a second wire bonded to the contacts of said emitter regions and the remaining contact of each group of Contacts patterned on said one surface.
Claim 14
Dependent Claim
151 words
A transistor comprised of a. a polymer film having two major surfaces; b. a group of three electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned under edges to provide upper and lower portions of said one surface; c. each contact extending on said upper and the lower portions of said one surface of the polymer film for facilitating the ohmic connection of a portion of each contact to a metal contact on a support member; d. a back-side collector contact transistor chip alloyed to one of the three contacts on the polymer film said chip having contacts to base and emitter regions; e. a first wire bonded to the contact of said base region and a second contact on said polymer film; f. a second wire bonded to the contact of said emitter region and the remaining contact on the polymer film.
Claim 15
Dependent Claim
151 words
A transistor comprised of a. a polymer film having two major surfaces; b. a group of three electrically conductive contact patterns adhered to one major surface of said polymer film, said film having turned under edges to provide upper and lower portions of said one surface; c. each contact extending on said upper and the lower portions of said one surface of the polymer film for facilitating the ohmic connection of a portion of each contact to a metal contact on a support member; d. a back-side collector contact transistor chip alloyed to one of the three contacts on the polymer film said chip having contacts to base and emitter regions; e. a first wire bonded to the contact of said base region and a second contact on said polymer film; f. a second wire bonded to the contact of said emitter region and the remaining contact on the polymer film.
Claim 16
Dependent Claim
38 words
The transistor of claim 12 including a. an insulating support member having three electrically conductive contacts thereon; and b. each of the contacts on the support member selectively bonded to one of the contacts on the polymer film.
Claim 17
Dependent Claim
188 words
A compact mounting pad for the permanent mounting of semiconductor chips thereon to facilitate handling, testing and later attachment thereof to further electrical circuitry, said mounting pad comprising a substrate of a thin flexible dielectric material having a plurality of conductive land areas thereon, the entire length of said conductive land areas being firmly bonded to said substrate, said land areas being electrically insulated from one another, at least two opposite edge portions of said substrate being folded across at least one separate conductive land area in such a manner that each said edge of the mounting pad comprises two thicknesses of dielectric substrate in facing relation, wherein at least one separate conductive land area remains exposed from the top surface of the mounting pad to the bottom surface of the mounting pad at each said edge of said mounting pad, and wherein the central portion of said mounting pad lying between said folds comprise a single thickness of said dielectric substrate; whereby said conductive land areas remain exposed for attachment to further electrical circuitry and are continuous from one surface of the mounting pad to the other.
Claim 18
Dependent Claim
188 words
A compact mounting pad for the permanent mounting of semiconductor chips thereon to facilitate handling, testing and later attachment thereof to further electrical circuitry, said mounting pad comprising a substrate of a thin flexible dielectric material having a plurality of conductive land areas thereon, the entire length of said conductive land areas being firmly bonded to said substrate, said land areas being electrically insulated from one another, at least two opposite edge portions of said substrate being folded across at least one separate conductive land area in such a manner that each said edge of the mounting pad comprises two thicknesses of dielectric substrate in facing relation, wherein at least one separate conductive land area remains exposed from the top surface of the mounting pad to the bottom surface of the mounting pad at each said edge of said mounting pad, and wherein the central portion of said mounting pad lying between said folds comprise a single thickness of said dielectric substrate; whereby said conductive land areas remain exposed for attachment to further electrical circuitry and are continuous from one surface of the mounting pad to the other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-10-21 | 1978-04-22 | 1978-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-10-21 | 1982-04-22 | 1982-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-10-21 | 1986-04-22 | 1986-10-22 | $7700.00 | Window Closed / Lapsed |