US3906144A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film circuit assemblies
Assignee: Lucas Electrical Co Ltd
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Filing: 1973-12-28
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Granted: 1975-09-16
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Expires: 1993-12-28
Abstract
Abstract A film circuit assembly which has a film circuit and a housing for the film circuit, the housing having a support plate formed of material possessing a high thermal conductivity and on which the film circuit is mounted, and a cover which together with the support plate encloses the film circuit and which supports electrical connections for the film circuit, the cover and film circuit defining a cavity which is at least partially filled with a material for protecting the film circuit.
Inventors
- 👤 David Wiley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 19:15
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10N; H10N97/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
112 words
A FILM CIRCUIT ASSEMBLY COMPRISING, A FILM CIRCUIT, A HOUSING FOR SAID FILM CIRCUIT, SAID HOUSING INCLUDING A SUPPORT PLAT FORMED OF A MATERIAL POSSESSING A HIGH THERMAL CONDUCTIVITY AND ON WHICH SAID FILM CIRCUITIS SUPPORTED, THE HOUSING FURTHER INCLUDING A COVER WHICH TOGETHER WITH THE SUPPORT PLATE ENCLOSES SAID FILM CIRCUIT, A LAYER OF A FLUID MATERIAL HAVING A HIGH THERMAL CONDUCTIVITY SANDWICHED BETWEEN SAID FILM CIRCUIT AND SUPPORT PLATE, AND, A PLURALITY OF RESILIENT ELECTRICAL CONNECTORS CARRIED BY SAID COVER AND RESILIENTLY ENGAGING SAID FILM CIRCUIT, SAID COVER AND SAID FILM CIRCUIT DEFINING THEREBETWEEN A CAVITY WHICH IS AT LEAST PARTIALLY FILLED WITH A MATERIAL FOR PROTECTING SAID FILM CIRCUIT.
Claim 2
Dependent Claim
112 words
A FILM CIRCUIT ASSEMBLY COMPRISING, A FILM CIRCUIT, A HOUSING FOR SAID FILM CIRCUIT, SAID HOUSING INCLUDING A SUPPORT PLAT FORMED OF A MATERIAL POSSESSING A HIGH THERMAL CONDUCTIVITY AND ON WHICH SAID FILM CIRCUITIS SUPPORTED, THE HOUSING FURTHER INCLUDING A COVER WHICH TOGETHER WITH THE SUPPORT PLATE ENCLOSES SAID FILM CIRCUIT, A LAYER OF A FLUID MATERIAL HAVING A HIGH THERMAL CONDUCTIVITY SANDWICHED BETWEEN SAID FILM CIRCUIT AND SUPPORT PLATE, AND, A PLURALITY OF RESILIENT ELECTRICAL CONNECTORS CARRIED BY SAID COVER AND RESILIENTLY ENGAGING SAID FILM CIRCUIT, SAID COVER AND SAID FILM CIRCUIT DEFINING THEREBETWEEN A CAVITY WHICH IS AT LEAST PARTIALLY FILLED WITH A MATERIAL FOR PROTECTING SAID FILM CIRCUIT.
Claim 3
Dependent Claim
24 words
An assembly as claimed in claim 1 wherein said layer of fluid material having a high thermal conductivity is a layer of silicon grease.
Claim 4
Dependent Claim
24 words
An assembly as claimed in claim 1 in which said cover is formed of synthetic resin material and the protective material is silicone resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-09-15 | 1979-03-17 | 1979-09-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-09-15 | 1983-03-17 | 1983-09-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-09-15 | 1987-03-17 | 1987-09-16 | $7700.00 | Window Closed / Lapsed |