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US3911327A Expired / Lapsed US ⏱️ 0.0 years remaining

Mounting assembly for integrated circuits heat sink and clamp means

Assignee: STMicroelectronics SRL
•
Filing: 1974-07-17
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Granted: 1975-10-07
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Expires: 1994-07-17
📄 Original PDF 🌐 Google Patents

Abstract

Abstract A mounting assembly for an integrated circuit comprises a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above the face and with a central region bridging the end regions and having a maximum height above the face smaller than the height of the end regions by a distance at most equal to the thickness of the integrated-circuit package to be mounted. Each of the end regions is formed with the throughgoing hole alignable with a similar hole in a heatsink plate and in a circuit board so that screws passing through each of these holes can clamp the end regions between the rigid heatsink plate and the circuit board with the central region pressing the integrated-circuit package resiliently against the heatsink plate.

Inventors

  • 👤 Bruno Murari
  • 👤 Giuseppe Cossuta
  • 👤 Sergio Orsucci

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 19:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W40/60; H10W40/611; H10W74/00; H10W74/10; H10W40/625

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 164 words
A semiconductor circuit board assembly comprising: an integrated-circuit package having a pair of opposite sides; a heatsink plate engaged with one of said sides and provided with apertures; a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above said face and with a central region extending between said end regions and having a maximum height above said face smaller than the height of said end regions by a distance at most equal to the thickness of said package between said sides, each end region being formed with a throughgoing bore at said face, said package being located in said central region between said sides; a circuit board formed with holes aligned with said bores; and clamping means extending through said apertures, said bores and said holes, thereby gripping said end regions between said heatsink plate and said circuit board and thereby pressing said package with said central region against said heatsink plate.
Claim 2
Dependent Claim 164 words
A semiconductor circuit board assembly comprising: an integrated-circuit package having a pair of opposite sides; a heatsink plate engaged with one of said sides and provided with apertures; a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above said face and with a central region extending between said end regions and having a maximum height above said face smaller than the height of said end regions by a distance at most equal to the thickness of said package between said sides, each end region being formed with a throughgoing bore at said face, said package being located in said central region between said sides; a circuit board formed with holes aligned with said bores; and clamping means extending through said apertures, said bores and said holes, thereby gripping said end regions between said heatsink plate and said circuit board and thereby pressing said package with said central region against said heatsink plate.
Claim 3
Dependent Claim 13 words
The assembly defined in claim 1 wherein said body is insulating and thermoplatic.
Claim 4
Dependent Claim 12 words
The assembly defined in claim 2 wherein said face is substantially planar.
Claim 5
Dependent Claim 24 words
The assembly defined in claim 3 wherein said end regions are spaced apart by a distance greater than the overall length of said package.
Claim 6
Dependent Claim 23 words
The assembly defined in claim 4 wherein said central region has a minimum height adjacent said end regions less than said maximum height.
Claim 7
Dependent Claim 52 words
The assembly defined in claim 5 wherein said central region is subdivided into a middle section of said maximum height and a pair of end sections tapering from said maximum height to said minimum height, whereby when clamped against said other side of said integrated-circuit package only said middle section engages same.
Claim 8
Dependent Claim 38 words
The assembly defined in claim 6 wherein said body is elongated and said end regions have a width transverse to the longitudinal centerline of said body equal to approximately twice the corresponding transverse width of said central region.
Claim 9
Dependent Claim 41 words
The assembly defined in claim 1 wherein said clamping means includes a pair of screws each extending through a respective bore and hole, said board also being formed with a pair of bores alignable with said holes and receiving said screws.
Claim 10
Dependent Claim 20 words
The assembly defined in claim 1 wherein said body and said board are substantially more flexible than said heatsink plate.

References Cited (Backward Citations)

US3219885A Cited
US3689804A Cited
US3812557A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1978-10-06 1979-04-07 1979-10-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1982-10-06 1983-04-07 1983-10-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1986-10-06 1987-04-07 1987-10-07 $7700.00 Window Closed / Lapsed

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