Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
164 words
A semiconductor circuit board assembly comprising: an integrated-circuit package having a pair of opposite sides; a heatsink plate engaged with one of said sides and provided with apertures; a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above said face and with a central region extending between said end regions and having a maximum height above said face smaller than the height of said end regions by a distance at most equal to the thickness of said package between said sides, each end region being formed with a throughgoing bore at said face, said package being located in said central region between said sides; a circuit board formed with holes aligned with said bores; and clamping means extending through said apertures, said bores and said holes, thereby gripping said end regions between said heatsink plate and said circuit board and thereby pressing said package with said central region against said heatsink plate.
Claim 2
Dependent Claim
164 words
A semiconductor circuit board assembly comprising: an integrated-circuit package having a pair of opposite sides; a heatsink plate engaged with one of said sides and provided with apertures; a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above said face and with a central region extending between said end regions and having a maximum height above said face smaller than the height of said end regions by a distance at most equal to the thickness of said package between said sides, each end region being formed with a throughgoing bore at said face, said package being located in said central region between said sides; a circuit board formed with holes aligned with said bores; and clamping means extending through said apertures, said bores and said holes, thereby gripping said end regions between said heatsink plate and said circuit board and thereby pressing said package with said central region against said heatsink plate.
Claim 3
Dependent Claim
13 words
The assembly defined in claim 1 wherein said body is insulating and thermoplatic.
Claim 4
Dependent Claim
12 words
The assembly defined in claim 2 wherein said face is substantially planar.
Claim 5
Dependent Claim
24 words
The assembly defined in claim 3 wherein said end regions are spaced apart by a distance greater than the overall length of said package.
Claim 6
Dependent Claim
23 words
The assembly defined in claim 4 wherein said central region has a minimum height adjacent said end regions less than said maximum height.
Claim 7
Dependent Claim
52 words
The assembly defined in claim 5 wherein said central region is subdivided into a middle section of said maximum height and a pair of end sections tapering from said maximum height to said minimum height, whereby when clamped against said other side of said integrated-circuit package only said middle section engages same.
Claim 8
Dependent Claim
38 words
The assembly defined in claim 6 wherein said body is elongated and said end regions have a width transverse to the longitudinal centerline of said body equal to approximately twice the corresponding transverse width of said central region.
Claim 9
Dependent Claim
41 words
The assembly defined in claim 1 wherein said clamping means includes a pair of screws each extending through a respective bore and hole, said board also being formed with a pair of bores alignable with said holes and receiving said screws.
Claim 10
Dependent Claim
20 words
The assembly defined in claim 1 wherein said body and said board are substantially more flexible than said heatsink plate.