Device for preparing integrated microcircuits for printed wiring

Claim 1

A device for preparing integrated microcircuits for printed wiring comprising in combination: a base; a female die in the form of two jaws; said jaws having lower surfaces which are fixedly attached to said base; upper surfaces of said jaws being located opposite to said lower surfaces; inner surfaces of said jaws being in perpendicular to said lower surfaces and facing each other; and outer surfaces of said jaws extending in parallel with the said inner surfaces; a microcircuit holder located between said jaws for gliding movement on said inner surfaces of the jaws; a spring between said base and said holder for normally biasing the latter away from the former; a solder supply unit; guides for said solder supply unit being disposed on the level of said upper surfaces of the jaws so as to extend in parallel with their inner surfaces and adapted to supply solder immediately below the ends of the outputs of said microcircuits; knives for cutting off the outputs of said microcircuits; a punch having a groove located directly opposite to said holder for the microcircuits; a clamp disposed in said groove; a second spring disposed in said groove between said punch and said clamp; a plate interacting with said punch so as to be movable relative to the latter in the direction of punch motion and of absorbing the working pressure thereof; a third spring disposed between said plate and said punch; and a means for cutting off a predetermined portion of the solder required for one microcircuit.

Claim 2

A device for preparing integrated microcircuits for printed wiring comprising in combination: a base; a female die in the form of two jaws; said jaws having lower surfaces which are fixedly attached to said base; upper surfaces of said jaws being located opposite to said lower surfaces; inner surfaces of said jaws being in perpendicular to said lower surfaces and facing each other; and outer surfaces of said jaws extending in parallel with the said inner surfaces; a microcircuit holder located between said jaws for gliding movement on said inner surfaces of the jaws; a spring between said base and said holder for normally biasing the latter away from the former; a solder supply unit; guides for said solder supply unit being disposed on the level of said upper surfaces of the jaws so as to extend in parallel with their inner surfaces and adapted to supply solder immediately below the ends of the outputs of said microcircuits; knives for cutting off the outputs of said microcircuits; a punch having a groove located directly opposite to said holder for the microcircuits; a clamp disposed in said groove; a second spring disposed in said groove between said punch and said clamp; a plate interacting with said punch so as to be movable relative to the latter in the direction of punch motion and of absorbing the working pressure thereof; a third spring disposed between said plate and said punch; and a means for cutting off a predetermined portion of the solder required for one microcircuit.