US3918926A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plural copper-layer treatment of copper foil and article made thereby
Assignee: Circuit Foil USA Inc
•
Filing: 1971-10-08
•
Granted: 1975-11-11
•
Expires: 1991-10-08
Abstract
Abstract Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.
Inventors
- 👤 Adam M Wolski
- 👤 Charles B Yates
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:37
CPC Classifications
C; C07; C07D; C07D239/00; C07D239/02; C07D239/24; C07D239/28; C07D239/46; C07D239/52; C07D239/54; C07D239/545; C07D239/553; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/58; C25D5/00; C25D5/10; C25D5/60; C25D5/605; C25D5/615; C25D5/617; G; G01; G01N; G01N33/00; G01N33/0004; G01N33/0009; G01N33/0011; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/936; Y10T; Y10T428/00; Y10T428/12; Y10T428/12389; Y10T428/12396; Y10T428/12472; Y10T428/12493; Y10T428/12681; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
159 words
A PROCESS FOR IMPROVING THE BOND STRENGTH OF COPPER FOIL THROUGH THE ELECTROCHEMICAL TREATMENT OF A SURFACE THEREOF COMPRISING SUBJECTING SAID SURFACE TO A TOW-STEP ELECTROCHEMICAL PRETREATMENT PRIOR TO THE APPLICATION OF SAID ELECTROCHEMICAL TREATMENT, THE FIRST STEP OF SAID PRETREATMENT COMPRISING SUBJECTING SAID SURFACE TO AN ARESENIC AND COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROLYTICALLY DEPOSIT THEREON A FIRST COPPER LAYER WHICH INCREASES THE BOND STRENGTH OF THE RAW FOIL, THE SECOND STEP OF SAID PRETREATMENT COMPRISING SUBJECTING SAID SURFACE TO A COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROLYTICALLY DEPOSIT THEREON A SECOND COPPER LAYER WHICH SUSTANTIALLY CONFORMS TO THE CONFIGURATION OF THE FIRST LAYER AND REDUCES THE POWDER TRANSFER CHARACTERISTICS OF SAID FIRST LAYER, AND THEN GIVING SAID PRETREATED FOIL AN ELECTROCHEMICAL TREATMENT IN WHICH SAID SURFACE IS SUBJECTED TO A COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROYTICALLY DEPOSIT THEREON A THIRD, COPPER-CONTAINING, MICROCRYSTALLINE LAYER WHICH FURTHER INCREASES THE BOND STRENGHT OF SAID FOIL.
Claim 2
Dependent Claim
159 words
A PROCESS FOR IMPROVING THE BOND STRENGTH OF COPPER FOIL THROUGH THE ELECTROCHEMICAL TREATMENT OF A SURFACE THEREOF COMPRISING SUBJECTING SAID SURFACE TO A TOW-STEP ELECTROCHEMICAL PRETREATMENT PRIOR TO THE APPLICATION OF SAID ELECTROCHEMICAL TREATMENT, THE FIRST STEP OF SAID PRETREATMENT COMPRISING SUBJECTING SAID SURFACE TO AN ARESENIC AND COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROLYTICALLY DEPOSIT THEREON A FIRST COPPER LAYER WHICH INCREASES THE BOND STRENGTH OF THE RAW FOIL, THE SECOND STEP OF SAID PRETREATMENT COMPRISING SUBJECTING SAID SURFACE TO A COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROLYTICALLY DEPOSIT THEREON A SECOND COPPER LAYER WHICH SUSTANTIALLY CONFORMS TO THE CONFIGURATION OF THE FIRST LAYER AND REDUCES THE POWDER TRANSFER CHARACTERISTICS OF SAID FIRST LAYER, AND THEN GIVING SAID PRETREATED FOIL AN ELECTROCHEMICAL TREATMENT IN WHICH SAID SURFACE IS SUBJECTED TO A COPPER-CONTAINING ELECTROLYTE UNDER CONDITIONS SUCH AS TO ELECTROYTICALLY DEPOSIT THEREON A THIRD, COPPER-CONTAINING, MICROCRYSTALLINE LAYER WHICH FURTHER INCREASES THE BOND STRENGHT OF SAID FOIL.
Claim 3
Dependent Claim
20 words
A process as defined in claim 1 wherein said electrochemical treatment involves the use of an arsenic and copper-containing electrolyte.
Claim 4
Dependent Claim
29 words
A process as defined in claim 2 wherein the copper and arsenic content in the electrolyte in said first step and in said electrochemical treatment are approximately as follows:
Claim 5
Dependent Claim
29 words
A process as defined in claim 2 wherein the copper and arsenic content in the electrolyte in said first step and in said electrochemical treatment are approximately as follows:
Claim 6
Dependent Claim
54 words
A process as defined in claim 2 wherein a sufficient amount of arsenic is present in the electrolyte in said first step of said pretreatment to increase the bond strength resulting from said electrochemical treatment over what it would have been had said electrochemical treatment been applied to foil which had not been pretreated.
Claim 7
Dependent Claim
25 words
A process as defined in claim 1 wherein approximately 1-4 grams of electrodeposit per square meter of foil surface is deposited during said electrochemical treatment.
Claim 8
Dependent Claim
40 words
A process for improving the bond strength of copper foil comprising subjecting a surface of said foil to three electrochemicaL treatments such as to electrodeposit thereon three copper layers, said three treatments being carried out approximately under the following conditions:
Claim 9
Dependent Claim
40 words
A process for improving the bond strength of copper foil comprising subjecting a surface of said foil to three electrochemicaL treatments such as to electrodeposit thereon three copper layers, said three treatments being carried out approximately under the following conditions:
Claim 10
Dependent Claim
18 words
A process as defined in claim 7 wherein the conditions for said three treatments are approximately as follows:
Claim 11
Dependent Claim
18 words
A process as defined in claim 7 wherein the conditions for said three treatments are approximately as follows:
Claim 12
Dependent Claim
110 words
A process for improving the bond strength of copper foil through the electrochemical treatment of a surface thereof comprising subjecting said surface to a two-step electrochemical treatment, the first step of said treatment comprising subjecting said surface to an arsenic and copper-containing electrolyte under conditions such as to electrolytically deposit thereon a first copper layer which increases the bond strength of the raw foil; the second step of said treatment comprising subjecting said surface to a copper-containing electrolyte under conditions such as to electrolytically deposit thereon a second copper layer which substantially conforms to the configuration of the first layer and reduces the powder transfer characteristics of said first layer.
Claim 13
Dependent Claim
110 words
A process for improving the bond strength of copper foil through the electrochemical treatment of a surface thereof comprising subjecting said surface to a two-step electrochemical treatment, the first step of said treatment comprising subjecting said surface to an arsenic and copper-containing electrolyte under conditions such as to electrolytically deposit thereon a first copper layer which increases the bond strength of the raw foil; the second step of said treatment comprising subjecting said surface to a copper-containing electrolyte under conditions such as to electrolytically deposit thereon a second copper layer which substantially conforms to the configuration of the first layer and reduces the powder transfer characteristics of said first layer.
Claim 14
Dependent Claim
8 words
The product of the process of claim 1.
Claim 15
Dependent Claim
8 words
The product of the process of claim 6.
Claim 16
Dependent Claim
8 words
The product of the process of claim 2.
Claim 17
Dependent Claim
8 words
The product of the process of claim 3.
Claim 18
Dependent Claim
8 words
The product of the process of claim 4.
Claim 19
Dependent Claim
8 words
The product of the process of claim 5.
Claim 20
Dependent Claim
8 words
The product of the process of claim 7.
Claim 21
Dependent Claim
8 words
The product of the process of claim 8.
Claim 22
Dependent Claim
8 words
The product of the process of claim 9.
Claim 23
Dependent Claim
8 words
The product of the process of claim 10.
Claim 24
Dependent Claim
82 words
COPPER FOIL HAVING ON A FACE THEREOF THREE ELECTRODEPOSITED SUPERPOSED LAYERS THE LAYER CLOSEST TO SAID FACE CONTAINING ARSENIC AND COPPER, THE INTERMEDIATE LAYER BEING A COPPER ELECTRODEPOSIT WHICH SUBSTANTIALLY CONFORMS TO THE CONFIGURATION OF SAID CLOSEST LAYER AND SERVES TO REDUCE THE POWDER TRANSFER CHARACTERISTICS OF SAID CLOSEST LAYER, THE THIRD OUTER MOST LAYER BEING COPPER-CONTAING AND MICROCYSTALLINE, SAID THIRD LAYER INCREASING THE BOND STRENGTH OF SAID FOIL OVER AND ABOVE THE BOND STRENGTH PROVIDED BY SAID CLOSEST AND INTERMEDIATE LAYERS.
Claim 25
Dependent Claim
82 words
COPPER FOIL HAVING ON A FACE THEREOF THREE ELECTRODEPOSITED SUPERPOSED LAYERS THE LAYER CLOSEST TO SAID FACE CONTAINING ARSENIC AND COPPER, THE INTERMEDIATE LAYER BEING A COPPER ELECTRODEPOSIT WHICH SUBSTANTIALLY CONFORMS TO THE CONFIGURATION OF SAID CLOSEST LAYER AND SERVES TO REDUCE THE POWDER TRANSFER CHARACTERISTICS OF SAID CLOSEST LAYER, THE THIRD OUTER MOST LAYER BEING COPPER-CONTAING AND MICROCYSTALLINE, SAID THIRD LAYER INCREASING THE BOND STRENGTH OF SAID FOIL OVER AND ABOVE THE BOND STRENGTH PROVIDED BY SAID CLOSEST AND INTERMEDIATE LAYERS.
Claim 26
Dependent Claim
14 words
Copper foil as defined in claim 21 wherein said third outermost layer is copper-arsenic.
Claim 27
Dependent Claim
33 words
A PRINTED CIRCUIT BOARD COMPRISED OF A DIELECTRIC SUBSTRATE BONDED TO WHICH IS THE COPPER FOIL OF CLAIM 21, THE PORTION OF SAID FOIL BEING CLOSEST TO SAID SUBSTRATE BEING SAID THIRD LAYER.
Claim 28
Dependent Claim
33 words
A printed circuit board comprised of a dIelectric substrate bonded to which is the copper foil of claim 22, the portion of said foil being closest to said substrate being said third layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-11-10 | 1979-05-12 | 1979-11-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-11-10 | 1983-05-12 | 1983-11-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-11-10 | 1987-05-12 | 1987-11-11 | $7700.00 | Window Closed / Lapsed |