US3923609A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of joining silicon metal
Assignee: PPG Industries Inc
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Filing: 1973-12-19
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Granted: 1975-12-02
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Expires: 1993-12-19
Abstract
Abstract Disclosed is a method of joining a silicon metal work piece to a second metallic work piece. In the disclosed method, an adherent surface is provided on the silicon work piece. A pool is then provided on the surface of the silicon, in contact with the adherent surface and with the second metallic work piece. The pool is then solidified to join the silicon work piece and the second work piece.
Inventors
- 👤 Cletus N Welch
- 👤 Aleksandrs Martinsons
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:39
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/001; C; C25; C25B; C25B9/00; F; F16; F16B; F16B11/00; F16B11/006; B23K2035/008
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
128 words
A METHOD OF JOINING AN ELECTROCONDUCTIVE SILICON METAL WORKPIECE COMPRISING SILICON AND SUFFICIENT DOPANT TO PROVIDE AN ELECTROCONDUCTIVITY GREATER THAN 10**2 (OHM-CENTIMETERS)-1 TO A SECOND METALLIC WORK PIECE WHICH METHOD COMPRISES: A. ELECTROPLATING A SURFACE OF AN ADHERENT MATERIAL CHOSEN FROM THE GROUP CONSISTING OF NICKEL, COPPER, TIN, ALUMINUM, ZINC, SILVER, PALLADIUM, PLATINUM, AND GOLD ON THE SRUFACE OF THE SILICON WORK PIECE TO BE JOINED TO THE SECOND METALLIC WORK PIECE; B. PROVIDING A POOL OF AN ELECTRICALLY CONDUCTIVE EPOXY RESIN BONDING MATERIAL IN CONTACT WITH THE ELECTROPLATED SURFACE OF THE ADHERENT MATERIAL ON THE SURFACE OF THE SILICON WORK PIECE AND WITH THE SECOND METALLIC WORK PIECE; AND C. SOLIDIFYING THE BONDING MATERIAL WHEREBY TO JOIN THE SILICON WORK PIECE AND THE SECOND METALLIC WORK PIECE.
Claim 2
Independent Claim
128 words
A METHOD OF JOINING AN ELECTROCONDUCTIVE SILICON METAL WORKPIECE COMPRISING SILICON AND SUFFICIENT DOPANT TO PROVIDE AN ELECTROCONDUCTIVITY GREATER THAN 10**2 (OHM-CENTIMETERS)-1 TO A SECOND METALLIC WORK PIECE WHICH METHOD COMPRISES: A. ELECTROPLATING A SURFACE OF AN ADHERENT MATERIAL CHOSEN FROM THE GROUP CONSISTING OF NICKEL, COPPER, TIN, ALUMINUM, ZINC, SILVER, PALLADIUM, PLATINUM, AND GOLD ON THE SRUFACE OF THE SILICON WORK PIECE TO BE JOINED TO THE SECOND METALLIC WORK PIECE; B. PROVIDING A POOL OF AN ELECTRICALLY CONDUCTIVE EPOXY RESIN BONDING MATERIAL IN CONTACT WITH THE ELECTROPLATED SURFACE OF THE ADHERENT MATERIAL ON THE SURFACE OF THE SILICON WORK PIECE AND WITH THE SECOND METALLIC WORK PIECE; AND C. SOLIDIFYING THE BONDING MATERIAL WHEREBY TO JOIN THE SILICON WORK PIECE AND THE SECOND METALLIC WORK PIECE.
Claim 3
Dependent Claim
25 words
The method of claim 1 comprising electroplating a material chosen from the group consisting of nickel and copper onto the electroconductive silicon metal work piece.
Claim 4
Dependent Claim
30 words
The method of claim 1 wherein the molten pool is provided by a material having a melting point lower than the melting point of the electroconductive silicon metal work piece.
Claim 5
Dependent Claim
17 words
The method of claim 1 wherein the second work piece is integral to the silicon work piece.
Claim 6
Independent Claim
131 words
A method of providing a removably mountable electroconductive silicon metal member comprising silicon and sufficient dopant to provide an electroconductivity greater than 102 (ohm-centimeters) 1, which method comprises: a. providing an electroconductive silicon metal member having an aperture therein; b. electroplating a surface of a material chosen from the group consisting of copper, nickel, tin, aluminum, zinc, silver, palladium, platinum, and gold adherent to silicon and receptive to a bonding material on the surface of the silicon within the aperture; c. providing a metal stud within said aperture; d. providing a pool of the epoxy resin bonding material within the aperture and in contact with the stud and the electroplated surface within the aperture; e. cooling the silicon member, whereby to provide a bond between the stud and the silicon member.
Claim 7
Independent Claim
131 words
A method of providing a removably mountable electroconductive silicon metal member comprising silicon and sufficient dopant to provide an electroconductivity greater than 102 (ohm-centimeters) 1, which method comprises: a. providing an electroconductive silicon metal member having an aperture therein; b. electroplating a surface of a material chosen from the group consisting of copper, nickel, tin, aluminum, zinc, silver, palladium, platinum, and gold adherent to silicon and receptive to a bonding material on the surface of the silicon within the aperture; c. providing a metal stud within said aperture; d. providing a pool of the epoxy resin bonding material within the aperture and in contact with the stud and the electroplated surface within the aperture; e. cooling the silicon member, whereby to provide a bond between the stud and the silicon member.
Claim 8
Dependent Claim
28 words
The method of claim 5 comprising electroplating a material chosen from the group consisting of copper and nickel onto the surface of the silicon member within the aperture.
Claim 9
Dependent Claim
18 words
The method of claim 5 wherein the silicon member is a casting and the aperture is cast therein.
Claim 10
Dependent Claim
27 words
The method of claim 5 wherein the pool is provided by a bonding material having a melting point lower than the melting point of the silicon member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-12-01 | 1979-06-02 | 1979-12-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-12-01 | 1983-06-02 | 1983-12-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-12-01 | 1987-06-02 | 1987-12-02 | $7700.00 | Window Closed / Lapsed |