US4039698A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making patterned platinum metallization
Assignee: AT&T Inc
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Filing: 1976-01-23
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Granted: 1977-08-02
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Expires: 1996-01-23
Abstract
Abstract A method is disclosed for making precisely patterned platinum films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a platinum compound, whose heat of formation is in the range of from -100 to +10 Kcal/mole, patterning the film, and thermally reducing the patterned film to platinum metal.
Inventors
- 👤 David Bruce Fraser
- 👤 Alfred Urquhart MacRae
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 13:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/105; Y; Y10; Y10S; Y10S430/00; Y10S430/143; Y10S430/167; Y10S430/168
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
113 words
A method for making a patterned layer of platinum metal on a substrate comprising the steps of depositing on said substrate a first layer, depositing on said first layer a second layer of a resist material, patterning said second layer by selectively removing portions of said resist material and thereby exposing portions of said first layer, patterning said first layer by physically removing the exposed portions of said first layer, and removing the remaining portions of said second layer CHARACTERIZED IN THAT (1) said first layer is platinum oxide and (2) after removing the exposed portions of said first layer the remaining portions of said first layer are heat reduced to platinum metal.
Claim 2
Independent Claim
113 words
A method for making a patterned layer of platinum metal on a substrate comprising the steps of depositing on said substrate a first layer, depositing on said first layer a second layer of a resist material, patterning said second layer by selectively removing portions of said resist material and thereby exposing portions of said first layer, patterning said first layer by physically removing the exposed portions of said first layer, and removing the remaining portions of said second layer CHARACTERIZED IN THAT (1) said first layer is platinum oxide and (2) after removing the exposed portions of said first layer the remaining portions of said first layer are heat reduced to platinum metal.
Claim 3
Dependent Claim
26 words
Method of claim 1 in which said layer of platinum compound is deposited in a thickness in the range of from 0.01 micrometer to 5.0 micrometers.
Claim 4
Dependent Claim
14 words
Method of claim 1 in which said platinum compound is deposited by reactive sputtering.
Claim 5
Dependent Claim
14 words
Method of claim 1 in which said platinum compound is deposited by plasma deposition.
Claim 6
Dependent Claim
13 words
Method of claim 1 in which said platinum compound is applied in solution.
Claim 7
Dependent Claim
14 words
Method of claim 1 in which said patterning is carried out by chemical etching.
Claim 8
Dependent Claim
14 words
Method of claim 1 in which said patterning is carried out by sputter etching.
Claim 9
Dependent Claim
13 words
Method of claim 1 in which said patterning is performed by ion milling.
Claim 10
Dependent Claim
14 words
Method of claim 1 in which said patterning is carried out by plasma etching.
Claim 11
Dependent Claim
30 words
Method of claim 1 in which said patterned platinum compound layer is heat reduced to platinum metal at a temperature in the range of from 100° C. to 500° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-08-01 | 1981-01-31 | 1981-08-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-08-01 | 1985-01-31 | 1985-08-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-08-01 | 1989-01-31 | 1989-08-02 | $7700.00 | Window Closed / Lapsed |