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US4048670A Expired / Lapsed US ⏱️ 0.0 years remaining

Stress-free hall-cell package

Assignee: Allegro Microsystems LLC
•
Filing: 1975-06-30
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Granted: 1977-09-13
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Expires: 1995-06-30
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Abstract

Abstract A thin stress-free hall-cell package includes a semiconductor hall-cell chip that is completely enveloped by a resilient cushioning material which is in turn held within a cup. The cup is attached to or is a part of at least one of the metal leads. Wires connect the leads to terminal-pads on the chip through the resilient cushioning material. The method for making the package includes providing support for the cup by one or more of the leads, placing the chip in the cup, dispensing a silicone resin into the cup and heat curing the resin. The package is completed with encapsulation of the cup and adjacent lead ends by a hard resin. The cup advantageously has a hole in its bottom such that a chip placed thereover is held in position for wire bonding by evacuating the hole from underneath by means of a vacuum system. A hot pin is then inserted in the hole to elevate the chip, the pin is retracted to be about flush with the inside of the cup bottom and liquid resin dispersed therein and completely envelops the chip. The resin cures locally about the hot pin. The pin is removed and the resin is completely cured in an oven.

Inventors

  • 👤 Hubert Eysermans

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 06:36
CPC Classifications
H; H10; H10N; H10N52/00; H10N52/80; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 151 words
A stress-free hall-cell package comprising: a. a semiconductor chip having a hall-cell formed therein and lying in one plane, said chip having conductive terminal pads on a surface thereof for providing electrical access to said hall-cell; b. at least three metal leads, an end portion of each of said leads lying in and defining another plane that is essentially parallel with said one plane; c. a cup abutting at least one of said metal leads; d. at least three metal wires each having one end connected to one of said terminal pads and another end connected to one of said leads near said end portion thereof; e. an insulative elastomeric protective covering being contained in said cup, and completely except at said one end of said wires; and f. an electrically insulating housing means for encapsulating and providing mechanical support to said cup and to said end portions of said leads.
Claim 2
Dependent Claim 151 words
A stress-free hall-cell package comprising: a. a semiconductor chip having a hall-cell formed therein and lying in one plane, said chip having conductive terminal pads on a surface thereof for providing electrical access to said hall-cell; b. at least three metal leads, an end portion of each of said leads lying in and defining another plane that is essentially parallel with said one plane; c. a cup abutting at least one of said metal leads; d. at least three metal wires each having one end connected to one of said terminal pads and another end connected to one of said leads near said end portion thereof; e. an insulative elastomeric protective covering being contained in said cup, and completely except at said one end of said wires; and f. an electrically insulating housing means for encapsulating and providing mechanical support to said cup and to said end portions of said leads.
Claim 3
Dependent Claim 48 words
The package of claim 1 wherein said semiconductor chip additionally includes an integrated circuit amplifier and an electrical coupling means for coupling the output of said hall-cell to the input of said amplifier, whereby a portion of said electrical access to said hall-cell is had through said amplifier.
Claim 4
Dependent Claim 32 words
The package of claim 1 wherein said at least three leads are essentially rectangular in cross-section and lie in the namely said another plane, having been cut from a standard lead frame.
Claim 5
Dependent Claim 16 words
The package of claim 1 wherein said cup has a hole in a bottom portion thereof.
Claim 6
Dependent Claim 29 words
The package of claim 1 wherein said cup abuts two of said leads, said cups having been capable of being entirely supported thereby during the assembly of said package.
Claim 7
Dependent Claim 19 words
The package of claim 1 wherein said cup is a metal extension of said at least one abutting lead.
Claim 8
Dependent Claim 35 words
The package of claim 1 wherein said cup is formed by a ring having been mounted on a metal extension of one of said leads, said lead extension serving as the bottom of said cup.

References Cited (Backward Citations)

US2906931A Cited
US2915684A Cited
US3441813A Cited
US3568012A Cited
US3659164A Cited
US3742599A Cited
US3706840A Cited
US3820237A Cited
US3689864A Cited
US3778685A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-09-12 1981-03-14 1981-09-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-09-12 1985-03-14 1985-09-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-09-12 1989-03-14 1989-09-13 $7700.00 Window Closed / Lapsed

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