Method and apparatus for improving packaging density of discrete electronic components

Claim 1

A method for increasing packaging density of discrete electronic components mounted to a flexible printed circuit board, said method comprising the steps of: laying out the printed circuit pattern and component and terminal locations on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components when said flexible board is folded along the fold lines with the spaced portions in confronting relationship; positioning components and terminals at the laid-out locations on the spaced and central portions on one side of said flexible board with the components in orientations generally parallel with the surface of the board; soldering the leads of the components and terminals on the side of the board opposite to the components to secure the components and terminals physically to the board and make electrical interconnections between the printed circuit pattern and the components and terminals; and folding said flexible board along the fold lines so that said first and second portions of said board are substantially parallel and relatively close together in face-to-face relationship substantially perpendicular to and separated by the width of the central portion, at least some of said components and terminals on said first and second and central portions being in mutual interleaving relationship.

Claim 2

A method for increasing packaging density of discrete electronic components mounted to a flexible printed circuit board, said method comprising the steps of: laying out the printed circuit pattern and component and terminal locations on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components when said flexible board is folded along the fold lines with the spaced portions in confronting relationship; positioning components and terminals at the laid-out locations on the spaced and central portions on one side of said flexible board with the components in orientations generally parallel with the surface of the board; soldering the leads of the components and terminals on the side of the board opposite to the components to secure the components and terminals physically to the board and make electrical interconnections between the printed circuit pattern and the components and terminals; and folding said flexible board along the fold lines so that said first and second portions of said board are substantially parallel and relatively close together in face-to-face relationship substantially perpendicular to and separated by the width of the central portion, at least some of said components and terminals on said first and second and central portions being in mutual interleaving relationship.

Claim 3

A method for constructing an electronic circuit module comprised of a flexible printed circuit board, discrete electronic components and terminals, and a modular sub-assembly of elements, said method comprising the steps of: laying out the printed circuit pattern and locations of the components and sub-assembly elements on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board substantially along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components and elements when said flexible board is folded along the fold lines with the spaced portions in confronting relationship and the modular subassembly therebetween; positioning components at the laid-out locations on one side of said flexible board; securing said components physically to said flexible board to thereby make desired electrical interconnections; and folding said flexible board along the fold lines and around said modular sub-assembly so that said first and second spaced portions of said flexible board are substantially parallel and separated by the width of the central portion with said modular sub-assembly therebetween, at least some of said discrete components interleaving with elements of said modular sub-assembly.

Claim 4

A method for constructing an electronic circuit module comprised of a flexible printed circuit board, discrete electronic components and terminals, and a modular sub-assembly of elements, said method comprising the steps of: laying out the printed circuit pattern and locations of the components and sub-assembly elements on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board substantially along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components and elements when said flexible board is folded along the fold lines with the spaced portions in confronting relationship and the modular subassembly therebetween; positioning components at the laid-out locations on one side of said flexible board; securing said components physically to said flexible board to thereby make desired electrical interconnections; and folding said flexible board along the fold lines and around said modular sub-assembly so that said first and second spaced portions of said flexible board are substantially parallel and separated by the width of the central portion with said modular sub-assembly therebetween, at least some of said discrete components interleaving with elements of said modular sub-assembly.

Claim 5

A method for constructing an electronic circuit module comprised of an enclosure having a cavity therein, a flexible printed circuit board, discrete electronic components, elongated terminals accessible outside said module, said method comprising the steps of: laying out the printed circuit pattern and components and terminal locations on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board substantially along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components when said flexible board is folded along the fold lines with the spaced portions in confronting relationship; positioning components and terminals at the laid-out locations on the spaced and central portions on one side of said flexible board with the components in orientations generally parallel with the surface of the board; securing said components and terminals physically to said flexible board by soldering on the side of the board opposite to the components of thereby make desired electrical interconnections; folding said flexible board along the fold lines so that said first and second portions of said flexible board are substantially parallel and relatively close together in face-to-face relationship substantially perpendicular to and separated by the width of the central portion, at least some of said components and terminals on said first and second portions being in mutual interleaving relationship, at least some of said components interleaving with the terminals; and placing said combined flexible board, components and terminals in said cavity in said enclosure, with free end portions of the terminals extending therefrom.

Claim 6

A method for constructing an electronic circuit module comprised of an enclosure having a cavity therein, a flexible printed circuit board, discrete electronic components, elongated terminals accessible outside said module, said method comprising the steps of: laying out the printed circuit pattern and components and terminal locations on said flexible board, on first and second spaced portions thereof and on a central portion by which the spaced portions are separated, to facilitate folding said flexible board substantially along a fold line common to the first portion and the central portion and along another fold line common to the second portion and the central portion and to prevent interference between components when said flexible board is folded along the fold lines with the spaced portions in confronting relationship; positioning components and terminals at the laid-out locations on the spaced and central portions on one side of said flexible board with the components in orientations generally parallel with the surface of the board; securing said components and terminals physically to said flexible board by soldering on the side of the board opposite to the components of thereby make desired electrical interconnections; folding said flexible board along the fold lines so that said first and second portions of said flexible board are substantially parallel and relatively close together in face-to-face relationship substantially perpendicular to and separated by the width of the central portion, at least some of said components and terminals on said first and second portions being in mutual interleaving relationship, at least some of said components interleaving with the terminals; and placing said combined flexible board, components and terminals in said cavity in said enclosure, with free end portions of the terminals extending therefrom.