Abstract A novel plated lead frame strip and a novel method and apparatus for selectively plating the strip is described. The strip comprises a plurality of identical lead frame sections. Each of the lead frame sections comprises a plurality of leads. Each lead has a lead tip. In the center of each section and surrounded by the lead tips is a die-attach pad. The apparatus comprises in combination three plating stations. Each of the three stations is provided for plating a predetermined part of each of the lead frame sections. In the first station, a means is provided for plating the tips and the pad of a lead frame section with a first predetermined metallic plating -- e.g., a gold or copper strike. In the second station, a means is provided for masking the tips and plating the pad only with a second predetermined metallic plating -- e.g., a gold finish. In the third station, a means is provided for masking the pad and plating the tips with a third predetermined metallic plating -- e.g., silver. The stations are arranged in such a fashion that all three may be plating simultaneously with each one plating its respective part in the desired plating sequence.
A method of selectively plating a lead frame strip, said strip including a plurality of lead frames, each of said frames having a plurality of leads, each of said leads having a tip, and a die-attach pad comprising the steps of: plating each of said lead frames with a first gold strike plating, said first plating being directly on and restricted to the surface area of a predetermined portion of said tip of each of said leads and said die-attach pad; plating each of said lead frames with a second plating, said second plating being a gold finish plating directly on said first plating and restricted to the area of said die-attach pad; and plating each of said lead frames with a third plating, said third plating being a silver finish plating directly on said first plating and restricted to the area of said tip portion of each of said leads.
Claim 2
Independent Claim
151 words
A method of selectively plating a lead frame strip, said strip including a plurality of lead frames, each of said frames having a plurality of leads, each of said leads having a tip, and a die-attach pad comprising the steps of: plating each of said lead frames with a first gold strike plating, said first plating being directly on and restricted to the surface area of a predetermined portion of said tip of each of said leads and said die-attach pad; plating each of said lead frames with a second plating, said second plating being a gold finish plating directly on said first plating and restricted to the area of said die-attach pad; and plating each of said lead frames with a third plating, said third plating being a silver finish plating directly on said first plating and restricted to the area of said tip portion of each of said leads.