US4099663A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Severing wire or ribbon material adjacent an attachment point, such as a solder, bond or weld connection, particularly in semiconductor and thin film structures
Assignee: Robert Bosch GmbH
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Filing: 1977-03-11
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Granted: 1978-07-11
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Expires: 1997-03-11
Abstract
Abstract The wire, ribbon, or the like, is repetitively bent back and forth until it breaks, the bending being, preferably, effected rapidly, for example by means of an electromagnet fed, for example, with line frequency alternating current. The wire is guided in a guide tool which deflects the wire transversely to its axis rapidly back and forth, thus effecting breaking within about one second of application of bending stresses. This is particularly useful to sever tiny wires, in the order of 100 μm diameter, as connecting leads in semiconductor and thin film technology.
Inventors
- 👤 Klaus Brill
- 👤 Gunter Schmid
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 07:27
CPC Classifications
B; B26; B26D; B26D7/00; B26D7/08; B26D7/086; B23; B23D; B23D23/00; B26F; B26F3/00; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/50; H10W72/531; H10W72/533; H10W72/534; Y; Y10; Y10S; Y10S228/00; Y10S228/904; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49194
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
80 words
Method to attach a strand (1) such as by a solder, bond, or weld connection to a substrate and then to sever the strand (1) adjacent the attachment point (2) comprising the steps of guiding the strand to the attachment point (2); attaching the strand; subjecting the stand to repetitive bending stresses and continuing the bending stresses until the materials fails by moving the strand as guided, repetitively in a direction essentially perpendicular to the major axis of the strand.
Claim 2
Dependent Claim
80 words
Method to attach a strand (1) such as by a solder, bond, or weld connection to a substrate and then to sever the strand (1) adjacent the attachment point (2) comprising the steps of guiding the strand to the attachment point (2); attaching the strand; subjecting the stand to repetitive bending stresses and continuing the bending stresses until the materials fails by moving the strand as guided, repetitively in a direction essentially perpendicular to the major axis of the strand.
Claim 3
Dependent Claim
27 words
Method according to claim 1, wherein the step of subjecting the strand to bending stresses comprises rhythmically vibrating the strand back and forth with essentially equal excursions.
Claim 4
Dependent Claim
31 words
Method according to claim 1, wherein the step of subjecting the strand to bending stresses comprises bending the strand by vibrating the strand at a frequency of at least 100 Hz.
Claim 5
Dependent Claim
62 words
Method according to claim 1 wherein the step of subjecting the strand to bending stresses comprises bending the strand by generating oscillations by an electromagnet excited by alternating current and applying the oscillations as bending movement to the strand to move the strand in a direction essentially perpendicularly to its axis at the frequency of said alternating current, or a multiple thereof.
Claim 6
Dependent Claim
28 words
Method according to claim 4, wherein the bending step comprises vibrating the strand at a frequency of at least 100 Hz, by moving the strand back and forth.
Claim 7
Dependent Claim
84 words
Wire guiding and severing apparatus to sever a strand (1) having a central axis adjacent an attachment point (2) such as a solder, bond or weld connection, comprising a guide element (3) having a body with an opening formed therein just slightly larger than the strand (1) to guide the strand with slight clearance above its axis; and a vibrating apparatus (4) coupled to the guide element (3) and vibrating the guide element in a direction essentially perpendicularly to the axis of the strand.
Claim 8
Dependent Claim
84 words
Wire guiding and severing apparatus to sever a strand (1) having a central axis adjacent an attachment point (2) such as a solder, bond or weld connection, comprising a guide element (3) having a body with an opening formed therein just slightly larger than the strand (1) to guide the strand with slight clearance above its axis; and a vibrating apparatus (4) coupled to the guide element (3) and vibrating the guide element in a direction essentially perpendicularly to the axis of the strand.
Claim 9
Dependent Claim
42 words
Apparatus according to claim 6, wherein the vibrating apparatus (4) comprises an electromagnet energized by alternating current; and the guide element comprises an oscillating armature (3) located in magnetically attracting position with respect to the electromagnet and mechnically coupled to said body.
Claim 10
Dependent Claim
13 words
Apparatus according to claim 6, wherein said body comprises a tubular holder (3).
Claim 11
Dependent Claim
30 words
Apparatus according to claim 6, wherein said body (3) is elongated and said opening extends essentially lengthwise thereof, at least one terminal end of the opening (6) being outwardly flared.
Claim 12
Dependent Claim
41 words
Apparatus according to claim 9, wherein the vibrating apparatus (4) comprises an electromagnet energized by alternating current; and the guide element comprises an oscillating armature (3) in magnetically attracting position with respect to the electromagnet and mechanically coupled to said body.
Claim 13
Dependent Claim
70 words
Method according to claim 1 to effect a bonding connection to a semiconductor, thin film, or the like, and forming said substrate; comprising first guiding the strand in a tubular guide (3) to the attachment point (2); attaching the strand to the substrate by at least one of: soldering, bonding, welding; and then severing the strand by rythmically vibrating the guide (3) and hence the strand therein back and forth.
Claim 14
Dependent Claim
29 words
The method of claim 11, wherein the strand is a wire having a diameter of a fraction of a millimeter, for example in the order of about 1/10 mm.
Claim 15
Dependent Claim
46 words
Apparatus according to claim 6 for use in the manufacture of a bonding connection to a semiconductor, thin film, or the like, and forming a substrate, and wherein the body is essentially tubular and the opening therethrough has a diameter of a fraction of a millimeter.
Claim 16
Dependent Claim
16 words
Apparatus according to claim 7, wherein the frequency of the alternating current is power line frequency.
Claim 17
Dependent Claim
19 words
Apparatus according to claim 14, wherein the opening through the body has a diameter just slightly more than 1/10mm.
References Cited (Backward Citations)
US3747198A
Cited
US3999451A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-07-10 | 1982-01-09 | 1982-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-07-10 | 1986-01-09 | 1986-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-07-10 | 1990-01-09 | 1990-07-11 | $7700.00 | Window Closed / Lapsed |