Organosilicon high molecular weight compounds

Claim 1

An organosilicon high molecular weight compound useful for the production of silicon carbide moldings, which comprises silicon and carbon as the main skeleton components, has a number average molecular weight of 500-30,000, an intrinsic viscosity of 0.01-1.50, a silicon carbide residual amount of not less than 40% by weight after baking at a temperature of 800°-1,500° C. in a non-oxidizing atmosphere and consists of a polycarbosilane represented by the following molecular structures: ##STR20##

Claim 4

A method of producing organosilicon high molecular weight compounds useful for the production of silicon carbide moldings containing silicon and carbon as the main skeleton components and at least one foreign element other than silicon, carbon, hydrogen and oxygen and consisting of at least one of linear polycarbosilanes, cyclic polycarbosilanes and polycarbosilanes in which linear and cyclic polycarbosilanes are chemically bonded, which has a number average molecular weight of 500-30,000, an intrinsic viscosity of 0.01-1.50, a foreign element amount of 0.01-25% by weight and a silicon carbide residual amount of not less than 40% by weight after baking at a temperature of 800°-1,500° C. in a non-oxidizing atmosphere, which comprises thermally polycondensing a mixture of a least one organosilicon compound selected from the group consisting of (1) compounds having only Si-C bond, (2) compounds having Si-H bond in addition to Si-C bond, (3) compounds having Si-Hal bond, (4) compounds having Si-N bond, (5) Si-OR organoalkoxy (aroxy)silanes, (6) compounds having Si--OH bond, (7) compounds having Si--Si bond, (8) compounds having Si--O--Si bond, (9) esters of organosilicon compounds, and (10) peroxides of organosilicon compounds, and at least one of the organosilicon compound of the group (4) and organometallic compounds selected from the group consisting of (11) organometallic compounds containing a metal of Group I (inclusive coordination compounds), (12) organometallic compounds containing a metal of Group II (inclusive coordination compounds), (13) organometallic compounds containing a metal of Group III (inclusive coordination compounds), (14) organometallic compounds containing a metal of Group IV (inclusive coordination compounds), (15) organometallic compounds containing a metal of Group V (inclusive coordination compounds), (16) organometallic compounds containing a metal of Group VI (inclusive coordination compounds). (17) organometallic compounds containing a metal of Group VII (inclusive coordination compounds, and (18) organometallic compounds containing a metal of Group VIII (inclusive coordination compounds), at a temperature of 200°-1,500° C. under vacuum or in a gaseous atmosphere selected from an inert gas, hydrogen gas, CO gas, CO 2 gas, hydrocarbon gas and organosilicon compound gas.

Claim 5

A method of producing organosilicon high molecular weight compounds useful for the production of silicon carbide moldings containing silicon and carbon as the main skeleton components and at least one foreign element other than silicon, carbon, hydrogen and oxygen and consisting of at least one of linear polycarbosilanes, cyclic polycarbosilanes and polycarbosilanes in which linear and cyclic polycarbosilanes are chemically bonded, which has a number average molecular weight of 500-30,000, an intrinsic viscosity of 0.01-1.50, a foreign element amount of 0.01-25% by weight and a silicon carbide residual amount of not less than 40% by weight after baking at a temperature of 800°-1,500° C. in a non-oxidizing atmosphere, which comprises thermally polycondensing a mixture of a least one organosilicon compound selected from the group consisting of (1) compounds having only Si-C bond, (2) compounds having Si-H bond in addition to Si-C bond, (3) compounds having Si-Hal bond, (4) compounds having Si-N bond, (5) Si-OR organoalkoxy (aroxy)silanes, (6) compounds having Si--OH bond, (7) compounds having Si--Si bond, (8) compounds having Si--O--Si bond, (9) esters of organosilicon compounds, and (10) peroxides of organosilicon compounds, and at least one of the organosilicon compound of the group (4) and organometallic compounds selected from the group consisting of (11) organometallic compounds containing a metal of Group I (inclusive coordination compounds), (12) organometallic compounds containing a metal of Group II (inclusive coordination compounds), (13) organometallic compounds containing a metal of Group III (inclusive coordination compounds), (14) organometallic compounds containing a metal of Group IV (inclusive coordination compounds), (15) organometallic compounds containing a metal of Group V (inclusive coordination compounds), (16) organometallic compounds containing a metal of Group VI (inclusive coordination compounds). (17) organometallic compounds containing a metal of Group VII (inclusive coordination compounds, and (18) organometallic compounds containing a metal of Group VIII (inclusive coordination compounds), at a temperature of 200°-1,500° C. under vacuum or in a gaseous atmosphere selected from an inert gas, hydrogen gas, CO gas, CO 2 gas, hydrocarbon gas and organosilicon compound gas.