US4199777A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and a method of manufacturing the same
Assignee: Hitachi Ltd
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Filing: 1977-02-02
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Granted: 1980-04-22
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Expires: 1997-02-02
Abstract
Abstract A semiconductor device includes at least two different elements having different functions. At least one of the elements is fixed within a recess provided in a substrate, and wirings are provided on an insulating film deposited commonly on the elements and the substrate, so that there is no step or clearance between the elements or between the element and the substrate, making it possible to easily form good interconnections.
Inventors
- 👤 Eiichi Maruyama
- 👤 Hideaki Yamamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:51
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/191; H10D; H10D62/00; H10D62/80; H10D62/82; H10F99/00; H10H; H10H20/00; H10H20/80; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/69; H10W70/698; H10W90/00; H10W90/20; H10W90/28; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/68; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/90; H10W72/941; H10W72/9413; H10W90/10; H10W90/22; H10W90/701; H10W90/731; H10W90/732
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
156 words
A semiconductor device comprising: a substrate containing at least two semiconductor elements made of semiconductor materials different from each other, one of said elements being disposed and fixed in a first recess provided in said substrate by a hardened fluid material, and the other element being disposed in a second recess provided in said substrate, wherein said one element is finished semiconductor chip made of a material different from that of the substrate; an insulating film disposed on said substrate and said elements and having apertures extending therethrough exposing surface portions of said elements wherein the top surface of the insulating film provides a flat surface free of steps between the apertures; and conductive material disposed on said insulating film and extending through said apertures so as to be in contact with both of said elements so that the conductive material forms a flat connection free of any steps over the insulating film between said elements.
Claim 2
Dependent Claim
156 words
A semiconductor device comprising: a substrate containing at least two semiconductor elements made of semiconductor materials different from each other, one of said elements being disposed and fixed in a first recess provided in said substrate by a hardened fluid material, and the other element being disposed in a second recess provided in said substrate, wherein said one element is finished semiconductor chip made of a material different from that of the substrate; an insulating film disposed on said substrate and said elements and having apertures extending therethrough exposing surface portions of said elements wherein the top surface of the insulating film provides a flat surface free of steps between the apertures; and conductive material disposed on said insulating film and extending through said apertures so as to be in contact with both of said elements so that the conductive material forms a flat connection free of any steps over the insulating film between said elements.
Claim 3
Dependent Claim
17 words
A semiconductor device according to claim 1, wherein a first of said elements is made of silicon.
Claim 4
Dependent Claim
35 words
A semiconductor device according to claim 2, wherein a second of said elements is made of a material selected from the group consisting of a group II-group VI compound and a group III-group V compound.
Claim 5
Dependent Claim
19 words
A semiconductor device according to claim 2, wherein a second of said elements is made of an amorphous semiconductor.
Claim 6
Dependent Claim
34 words
A semiconductor device according to claim 4, wherein said amorphous semiconductor is made of at least one material selected from the group consisting of Se-As-Te, Se-Ge-Te, amorphous silicon, and As 2 Se 3 .
Claim 7
Dependent Claim
14 words
A semiconductor device according to claim 1, wherein said substrate is made of silicon.
Claim 8
Dependent Claim
48 words
A semiconductor device according to claim 6, wherein said one element is made of a material selected from the group consisting of a group II-group VI compound and a group III-group V compound, and another of said elements is made of silicon and is formed within said substrate.
Claim 9
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein said substrate is made of a material selected from the group consisting of glass and a ceramic.
Claim 10
Dependent Claim
20 words
A semiconductor device according to claim 1, wherein another of said elements is disposed on the surface of said substrate.
Claim 11
Dependent Claim
46 words
A semiconductor device according to claim 9, wherein said one element is made of silicon and said another element is made of at least one material selected from the group consisting of a group II-group VI compound, a group III-group V compound, and an amorphous semiconductor.
Claim 12
Dependent Claim
22 words
A semiconductor device according to claim 1, wherein another of said elements is disposed in a second recess provided in said substrate.
Claim 13
Dependent Claim
24 words
A semiconductor device according to claim 1, wherein another of said elements comprises a scanning circuit element, said one element comprises a photoelectric element.
Claim 14
Dependent Claim
42 words
A semiconductor device according to claim 12, wherein a plurality of said photoelectric elements are disposed in said recess, and wherein said conductive material is provided as a plurality of parallel, spaced-apart conductor layers interconnecting said photoelectric elements with said scanning element.
Claim 15
Dependent Claim
15 words
A semiconductor device according to claim 13, wherein said photoelectric elements are light emitting elements.
Claim 16
Dependent Claim
57 words
A semiconductor device according to claim 9, wherein said another element comprises a layer of photoconductive material disposed upon said conductive material and extending in a direction transverse to that of said conductive material, and a plurality of spaced apart stripe electrodes disposed on said layer of photoconductive material, so that said another element forms a photodetector.
Claim 17
Dependent Claim
51 words
A semiconductor device according to claim 9, wherein said another element comprises a layer of photoresponsive material disposed upon a conductive film formed on said substrate, said conductive material extending through an aperture in said insulating film so as to be in contact with the conductive film of said another element.
Claim 18
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein the insulating film extends into the recess surrounding the sides of the semiconductor element in said recess.
Claim 19
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein the first semiconductor element is bonded in the recess by an epoxy resin.
Claim 20
Dependent Claim
35 words
a semiconductor device according to claim 1, wherein the insulating film is a hardened insulation material which serves to both fix the first semiconductor element in the first recess and to form the insulating film.
Claim 21
Dependent Claim
155 words
A semiconductor device comprising: a substrate containing at least two semiconductor elements made of semiconductor materials different from each other, one of said elements being disposed and fixed in a first recess provided in said substrate by a hardened fluid material, and the other element being disposed on the surface of the substrate, wherein said one element is a finished semiconductor chip made of a material different from that of the substrate; an insulating film disposed on said substrate and said elements and having apertures extending therethrough exposing surface portions of said elements wherein the top surface of the insulating film provides a flat surface free of steps between the apertures; and conductive material disposed on said insulating film and extending through said apertures so as to be in contact with both of said elements to that the conductive material forms a flat connection free of any steps over the insulating film between said elements.
Claim 22
Dependent Claim
155 words
A semiconductor device comprising: a substrate containing at least two semiconductor elements made of semiconductor materials different from each other, one of said elements being disposed and fixed in a first recess provided in said substrate by a hardened fluid material, and the other element being disposed on the surface of the substrate, wherein said one element is a finished semiconductor chip made of a material different from that of the substrate; an insulating film disposed on said substrate and said elements and having apertures extending therethrough exposing surface portions of said elements wherein the top surface of the insulating film provides a flat surface free of steps between the apertures; and conductive material disposed on said insulating film and extending through said apertures so as to be in contact with both of said elements to that the conductive material forms a flat connection free of any steps over the insulating film between said elements.
Claim 23
Dependent Claim
21 words
A semiconductor device according to claim 20, wherein the first semiconductor element is bonded in the recess by an epoxy resin.
Claim 24
Dependent Claim
35 words
A semiconductor device according to claim 20, wherein the insulating film is a hardened insulation material which serves to both fix the first semiconductor element in the first recess and to form the insulating film.
References Cited (Backward Citations)
GB1165187A
Cited
US3754161A
Cited
DE2031444A1
Cited
US3761782A
Cited
US3699407A
Cited
US3858237A
Cited
US3864817A
Cited
US4001859A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-04-22 | 1983-10-22 | 1984-04-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-04-22 | 1987-10-22 | 1988-04-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-04-22 | 1991-10-22 | 1992-04-22 | $7700.00 | Window Closed / Lapsed |