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US4210704A Expired / Lapsed US ⏱️ 0.0 years remaining

Electrical devices employing a conductive epoxy resin formulation as a bonding medium

Assignee: AT&T Inc
•
Filing: 1978-08-04
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Granted: 1980-07-01
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Expires: 1998-08-04
📄 Original PDF 🌐 Google Patents

Abstract

Abstract A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.

Inventors

  • 👤 Edwin A. Chandross
  • 👤 Louis H. Sharpe

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 21:02
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4021; C08G59/20; C08G59/32; C08G59/38; C09; C09J; C09J163/00; C09J163/04; H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10; H10W; H10W20/00; H10W20/40; C08L; C08L2666/00; C08L2666/54; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24851; Y10T428/24868; Y10T428/24876; Y10T428/24893; Y10T428/24909; Y10T428/25; Y10T428/256; Y10T428/31504; Y10T428/31511; Y10T428/31515

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 165 words
Device comprising a first electrically conductive or semiconducting member and a second electrically conductive or semiconducting member, said first member being bonded to said second member by a bonding agent, said bonding agent consisting essentially of (a) a polyfunctional epoxide, (b) a reactive viscosity reducer which is a mono or difunctional aliphatic diglycidyl ether, (c) a curing agent, and (d) a conductive material, characterized in that said curing agent consists essentially of an imidazole compound having the general formula ##STR3## wherein R 1 represents hydrogen, a phenyl group or an alkoxyphenyl group having from 1-6 carbon atoms in the alkoxy chain; R 2 and R 3 represent an alkyl group of 1-6 carbon atoms, a phenyl group or hydrogen; and Y represents a cyclic group of the formula (CH 2 ) 4 or (CH 2 ) 5 , or O(CH 2 ) 4 ; or two alkyl groups, (R 4 ) 2 , wherein R 4 is an aklyl group having from 1-6 carbon atoms.
Claim 2
Dependent Claim 165 words
Device comprising a first electrically conductive or semiconducting member and a second electrically conductive or semiconducting member, said first member being bonded to said second member by a bonding agent, said bonding agent consisting essentially of (a) a polyfunctional epoxide, (b) a reactive viscosity reducer which is a mono or difunctional aliphatic diglycidyl ether, (c) a curing agent, and (d) a conductive material, characterized in that said curing agent consists essentially of an imidazole compound having the general formula ##STR3## wherein R 1 represents hydrogen, a phenyl group or an alkoxyphenyl group having from 1-6 carbon atoms in the alkoxy chain; R 2 and R 3 represent an alkyl group of 1-6 carbon atoms, a phenyl group or hydrogen; and Y represents a cyclic group of the formula (CH 2 ) 4 or (CH 2 ) 5 , or O(CH 2 ) 4 ; or two alkyl groups, (R 4 ) 2 , wherein R 4 is an aklyl group having from 1-6 carbon atoms.
Claim 3
Dependent Claim 30 words
Device in accordance with claim 1 in which said curing agent is in said bonding agent in an amount in the range of 0.03-0.1 mole per mole of epoxy group.
Claim 4
Dependent Claim 17 words
Device in accordance with claim 1 in which said bonding agent further contains a conductivity enhancing agent.
Claim 5
Dependent Claim 15 words
Device in accordance with claim 1 in which said curing agent consists essentially of 1-(N-dimethylcarbamoyl)-4-phenylimidazole.

References Cited (Backward Citations)

US3580776A Cited
US4048188A Cited
US3795047A Cited
US3862260A Cited
US4038742A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-07-01 1983-12-31 1984-07-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-07-01 1987-12-31 1988-07-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-07-01 1991-12-31 1992-07-01 $7700.00 Window Closed / Lapsed

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