US4246147A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Screenable and strippable solder mask and use thereof
Assignee: Novartis Corp
•
Filing: 1979-06-04
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Granted: 1981-01-20
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Expires: 1999-06-04
Abstract
Abstract A screenable and strippable solder mask composition which contains a polyepoxide or polyimide/amide; a detackifier and a high-temperature resistant filler; and use thereof for protecting predetermined areas on a substrate from the solder deposition.
Inventors
- 👤 Peter Bakos
- 👤 Russell E. Darrow
- 👤 Dennis L. Rivenburgh
- 👤 William F. Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 02:46
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0076; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0166; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/02; H05K2203/0264; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0783; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; Y; Y10; Y10T; Y10T428/00; Y10T428/26; Y10T428/263; Y10T428/264
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
120 words
A screenable, strippable solder mask composition containing: A. a film-forming polymer portion in the form of a liquid composition wherein the film-forming polymer is a polyimide/amide or a liquid polyepoxide; B. a detackifier compatible with the polymer being selected form the group of (1) liquid silicone oil (2) terpene (3) terpineol (4) drying oil, and (5) mixtures thereof; C. a solid high temperature resistant filler in an amount sufficient to render the composition removable from the substrate after solder application; wherein the ratio of A:B is about 2:1 to about 1:3, and provided that when A is a polyepoxide liquid, B includes said silicone oil; and wherein said composition is at least substantially free of hardener for said film-forming polymer.
Claim 2
Dependent Claim
120 words
A screenable, strippable solder mask composition containing: A. a film-forming polymer portion in the form of a liquid composition wherein the film-forming polymer is a polyimide/amide or a liquid polyepoxide; B. a detackifier compatible with the polymer being selected form the group of (1) liquid silicone oil (2) terpene (3) terpineol (4) drying oil, and (5) mixtures thereof; C. a solid high temperature resistant filler in an amount sufficient to render the composition removable from the substrate after solder application; wherein the ratio of A:B is about 2:1 to about 1:3, and provided that when A is a polyepoxide liquid, B includes said silicone oil; and wherein said composition is at least substantially free of hardener for said film-forming polymer.
Claim 3
Dependent Claim
15 words
The solder mask composition of claim 1 wherein the film-forming polymer is a liquid polyepoxide.
Claim 4
Dependent Claim
19 words
The solder mask composition of claim 1 wherein said film-forming polymer is a polyepoxide of epichlorohydrin and bisphenol A.
Claim 5
Dependent Claim
33 words
The solder mask composition of claim 1 wherein said polyepoxide has a viscosity of about 400 to about 5000 centipoises at 25° C., and a molecular weight of about 170 to about 250.
Claim 6
Dependent Claim
15 words
The solder mask composition of claim 1 wherein said film-forming polymer is a polyimide/amide polymer.
Claim 7
Dependent Claim
20 words
The solder mask composition of claim 1 wherein said film-forming polymer portion is a solution of a polyimide/amide in N-methyl-2-pyrrolidone.
Claim 8
Dependent Claim
19 words
The solder mask composition of claim 1 wherein said film-forming polymer is a polyimide/amide from pyromellitic dianhydride and 4,4'-diaminodiphenylether.
Claim 9
Dependent Claim
15 words
The solder mask composition of claim 1 wherein said detackifier is a liquid silicone oil.
Claim 10
Dependent Claim
13 words
The solder mask composition of claim 1 wherein said detackifier is a polydimethylsiloxane.
Claim 11
Dependent Claim
13 words
The solder mask composition of claim 1 wherein said detackifier is a terpineol.
Claim 12
Dependent Claim
23 words
The solder mask composition of claim 1 wherein said detackifier has a viscosity of about 25 to about 500 centipoises at 25° C.
Claim 13
Dependent Claim
21 words
The solder mask composition of claim 1 wherein said filler has a particle size of about 0.1 to about 20 microns.
Claim 14
Dependent Claim
21 words
The solder mask composition of claim 1 wherein said filler has a particle size of about 0.1 to about 5 microns.
Claim 15
Dependent Claim
30 words
The solder mask composition of claim 1 wherein said filler is selected from the group of ground glass, zinc oxide, silicon dioxide, alumina, high temperature resistant sands, and mixtures thereof.
Claim 16
Dependent Claim
21 words
The solder mask composition of claim 1 which has a viscosity of about 700 to about 15,000 centipoises at 25° C.
Claim 17
Dependent Claim
20 words
The solder mask composition of claim 1 having a viscosity of about 1000 to about 13,000 centipoises at 25° C.
Claim 18
Dependent Claim
20 words
The solder mask composition of claim 1 having a viscosity of about 7000 to about 12,500 centipoises at 25° C.
Claim 19
Dependent Claim
31 words
The solder mask composition of claim 1 wherein the ratio of the film-forming polymer of the polymer portion of the composition relative to the detackifier is about 1:1 to about 2:3.
Claim 20
Dependent Claim
30 words
The solder mask composition of claim 1 wherein the amount of filler relative to the film-forming polymer component of the polymer portion of the composition is about 1:6 to 6:1.
Claim 21
Dependent Claim
15 words
The solder mask composition of claim 1 wherein said detackifier is a natural drying oil.
Claim 22
Dependent Claim
31 words
The solder mask composition of claim 1 wherein the amount of filler relative to the film-forming polymer component of the polymer portion of the composition is about 2:1 to about 6:1.
Claim 23
Dependent Claim
15 words
The composition of claim 1 which is entirely free of hardener for said film-forming polymer.
Claim 24
Dependent Claim
18 words
A substrate coated in predetermined areas less than the entire area with the solder mask of claim 1.
Claim 25
Dependent Claim
16 words
The substrate of claim 23 wherein the coating thickness is about 1 to about 25 mils.
Claim 26
Dependent Claim
22 words
The method of claim 24 wherein the application of solder is conducted at a temperature of about 300° to about 400° C.
Claim 27
Dependent Claim
16 words
The substrate of claim 23 wherein the coating thickness is about 5 to about 10 mils.
Claim 28
Dependent Claim
16 words
The substrate of claim 23 wherein the coating thickness is about 2 to about 3 mils.
Claim 29
Independent Claim
182 words
A method for protecting predetermined areas on a substrate from solder deposition which comprises: A. applying to predetermined areas less than the entire area of a substrate by screen printing a screenable and strippable mask composition containing: (1) a film-forming polymer portion in the form of a liquid composition wherein the film-forming polymer is a polyimide/amide or a liquid polyepoxide; (2) a detackifier compatible with the polymer being selected from the group of (a) liquid silicone oil (b) terpene (c) terpineol (d) drying oil, and (e) mixtures thereof; (3) a solid high temperature resistant filler in an amount sufficient to render the composition removable from the substrate after solder application wherein the ratio of A:B is about 2:1 to about 1:3, and provided that when A is a polyepoxide liquid, B includes said silicone oil; and wherein said composition is at least substantially free of hardener from said film-forming polymer; B. drying the coated substrate to thereby harden the composition; C. applying solder whereby said solder does not adhere to those areas protected by the solder mask; D. removing the solder mask.
Claim 30
Independent Claim
182 words
A method for protecting predetermined areas on a substrate from solder deposition which comprises: A. applying to predetermined areas less than the entire area of a substrate by screen printing a screenable and strippable mask composition containing: (1) a film-forming polymer portion in the form of a liquid composition wherein the film-forming polymer is a polyimide/amide or a liquid polyepoxide; (2) a detackifier compatible with the polymer being selected from the group of (a) liquid silicone oil (b) terpene (c) terpineol (d) drying oil, and (e) mixtures thereof; (3) a solid high temperature resistant filler in an amount sufficient to render the composition removable from the substrate after solder application wherein the ratio of A:B is about 2:1 to about 1:3, and provided that when A is a polyepoxide liquid, B includes said silicone oil; and wherein said composition is at least substantially free of hardener from said film-forming polymer; B. drying the coated substrate to thereby harden the composition; C. applying solder whereby said solder does not adhere to those areas protected by the solder mask; D. removing the solder mask.
Claim 31
Dependent Claim
19 words
The method of claim 28 wherein said solder mask is removed by contact with a solvent at elevated temperature.
Claim 32
Dependent Claim
16 words
The method of claim 28 wherein said elevated temperature is about 100° to about 180° C.
Claim 33
Dependent Claim
21 words
The method of claim 28 wherein said drying is conducted at a temperature of about 50° C. to about 150° C.
Claim 34
Dependent Claim
17 words
The method of claim 28 wherein said drying is conducted at a temperature of about 150° C.
Claim 35
Dependent Claim
17 words
The method of claim 28 wherein said composition is entirely free of hardener for said film-forming polymer.
References Cited (Backward Citations)
GB416476A
Cited
US3073785A
Cited
US3288754A
Cited
US3305504A
Cited
US3458925A
Cited
US3440203A
Cited
US3816364A
Cited
US3556754A
Cited
US3781237A
Cited
US3843577A
Cited
US3926885A
Cited
US4121000A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-01-20 | 1984-07-21 | 1985-01-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-01-20 | 1988-07-21 | 1989-01-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-01-20 | 1992-07-21 | 1993-01-20 | $7700.00 | Window Closed / Lapsed |