US4271061A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin compositions for sealing semiconductors
Assignee: Nitto Denko Corp
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Filing: 1980-03-06
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Granted: 1981-06-02
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Expires: 2000-03-06
Abstract
Abstract In an epoxy resin composition for sealing a semiconductor element containing about 50 to 85% by weight of an inorganic filler, the improvement wherein the inorganic filler comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight based on the total weight of the silica powder and calcium silicate powder.
Inventors
- 👤 Hideto Suzuki
- 👤 Shunichi Hayashi
- 👤 Takahiro Yoshioka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:14
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; C; C04; C04B; C04B20/00; C04B20/10; C04B20/1018; C04B26/00; C04B26/02; C04B26/10; C04B26/14; C09; C09J; C09J163/00; C08; C08L; C08L2666/00; C08L2666/54
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
80 words
In an epoxy resin composition for sealing a semiconductor element containing about 50 to 85% by weight of an inorganic filler, the improvement wherein the inorganic filler comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight, based on the total weight of the silica powder and calcium silicate powder.
Claim 2
Dependent Claim
80 words
In an epoxy resin composition for sealing a semiconductor element containing about 50 to 85% by weight of an inorganic filler, the improvement wherein the inorganic filler comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight, based on the total weight of the silica powder and calcium silicate powder.
Claim 3
Dependent Claim
20 words
The composition of claim 1, wherein the amount of the calcium silicate powder is about 30 to 60% by weight.
Claim 4
Dependent Claim
27 words
The composition of claim 1, wherein the calcium silicate powder is a needle-like material having a particle size (longer diameter) of about 1μ to about 2 mm.
Claim 5
Dependent Claim
21 words
The composition of claims 1, 2 or 3, wherein the calcium silicate powder is an acetic acid treated calcium silicate powder.
Claim 6
Dependent Claim
17 words
The composition of claim 1, wherein the silica powder is a crystalline silica or an amorphous silica.
Claim 7
Dependent Claim
29 words
The composition of claims 1 or 5, wherein the silica powder has an average particle size of about 5 to 10μ with the maximum particle size being about 100μ.
Claim 8
Dependent Claim
12 words
The composition of claim 3, wherein said calcium silicate powder is wollostonite.
Claim 9
Dependent Claim
11 words
The composition of claim 1, wherein said composition is fire retardant.
Claim 10
Dependent Claim
83 words
In a semiconductor which is sealed with an epoxy resin composition, the improvement in which said resin composition comprises about 50 to 85% by weight of an inorganic filler, which comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight, based on the total weight of the silica powder and calcium silicate powder.
Claim 11
Dependent Claim
83 words
In a semiconductor which is sealed with an epoxy resin composition, the improvement in which said resin composition comprises about 50 to 85% by weight of an inorganic filler, which comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight, based on the total weight of the silica powder and calcium silicate powder.
Claim 12
Dependent Claim
20 words
The semiconductor of claim 9, wherein the amount of the calcium silicate powder is about 30 to 60% by weight.
Claim 13
Dependent Claim
27 words
The semiconductor of claim 9, wherein the calcium silicate powder is a needle-like material having a particle size (longer diameter) of about 1μ to about 2 mm.
Claim 14
Dependent Claim
21 words
The semiconductor of claims 9, 10 or 11, wherein the calcium silicate powder is an acetic acid treated calcium silicate powder.
Claim 15
Dependent Claim
17 words
The semiconductor of claim 9, wherein the silica powder is a crystalline silica or an amorphous silica.
Claim 16
Dependent Claim
29 words
The semiconductor of claims 9 or 13, wherein the silica powder has an average particle size of about 5 to 10μ with the maximum particle size being about 100μ.
Claim 17
Dependent Claim
12 words
The semiconductor of claim 11, wherein said calcium silicate powder is wollostonite.
Claim 18
Dependent Claim
11 words
The semiconductor of claim 9, wherein said composition is fire retardant.
Claim 19
Dependent Claim
36 words
The composition of claim 1, wherein the amount of inorganic fillers other than silica powder and calcium silicate powder is less than 45 parts by weight per 100 parts by weight silica and calcium silicate powder.
Claim 20
Dependent Claim
36 words
The semiconductor of claim 9, wherein the amount of inorganic fillers other than silica powder and calcium silicate powder is less than 45 parts by weight per 100 parts by weight silica and calcium silicate powder.
Claim 21
Dependent Claim
16 words
The composition of claim 1, wherein said inorganic filler consists of silica and calcium silicate powder.
Claim 22
Dependent Claim
16 words
The semiconductor of claim 9, wherein said inorganic filler consists of silica and calcium silicate powder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-06-01 | 1984-12-01 | 1985-06-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-06-01 | 1988-12-01 | 1989-06-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-06-01 | 1992-12-01 | 1993-06-02 | $7700.00 | Window Closed / Lapsed |