US4334966A
Expired / Lapsed
US
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Method of copper plating gravure cylinders
Assignee: MCGEAN CHEMICAL COMPANY Inc
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Filing: 1981-05-19
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Granted: 1982-06-15
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Expires: 2001-05-19
Abstract
Abstract A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.
Inventors
- 👤 Sidney C. Beach
- 👤 C. Richard Frisby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:49
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
95 words
A method of depositing on gravure rolls a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate, from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound.
Claim 2
Independent Claim
95 words
A method of depositing on gravure rolls a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate, from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound.
Claim 3
Dependent Claim
42 words
A process according to claim 1 wherein said polyether is present in an amount of about 3 grams/liter, said imidazole is present in an amount of about 1.0 milligram/liter, and said benzene compound is present in an amount of about 2.4 milligrams/liter.
Claim 4
Dependent Claim
34 words
A process according to claim 1 wherein a current of from about 30 to about 200 amperes/square foot is applied to the surface of the roll to deposit about 0.015 inch of copper thereon.
Claim 5
Dependent Claim
25 words
A process according to claim 3 wherein the bath is operated at a temperature in the range of from about 70 to about 80° F.
Claim 6
Dependent Claim
19 words
A process according to claim 1 wherein the bath contains from about 20 to about 80 ppm of chloride.
Claim 7
Dependent Claim
12 words
A process according to claim 1 wherein the polyether is polyethylene oxide.
Claim 8
Dependent Claim
13 words
A process according to claim 1 wherein the lower alkyl group is methyl.
Claim 9
Dependent Claim
18 words
A process according to claim 1 wherein the benzene compound is 2,2', dithio bis alkyl benzene sulfonic acid.
Claim 10
Dependent Claim
97 words
An additive to form a bath to electrodeposit a layer of copper especially adapted for electronic engraving of gravure rolls from a bath comprising from about 150 to about 225 grams/liter of copper sulfate, from about 35 to about 90 grams/liter of sulfuric acid, said additive consisting essentially of ingredients to provide from about 1 to about 15 grams/liter of a polyethylene oxide having a molecular weight ranging from 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of sulfonated, sulfurized benzene compound.
Claim 11
Dependent Claim
97 words
An additive to form a bath to electrodeposit a layer of copper especially adapted for electronic engraving of gravure rolls from a bath comprising from about 150 to about 225 grams/liter of copper sulfate, from about 35 to about 90 grams/liter of sulfuric acid, said additive consisting essentially of ingredients to provide from about 1 to about 15 grams/liter of a polyethylene oxide having a molecular weight ranging from 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of sulfonated, sulfurized benzene compound.
Claim 12
Dependent Claim
41 words
The additive of claim 9 wherein said polyether is present in an amount of about 3 grams/liter, said imidazole is present in an amount of about 1.0 milligram/liter, and said benzene compound is present in an amount of about 2.4 milligrams/liter.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-06-14 | 1985-12-14 | 1986-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-06-14 | 1989-12-14 | 1990-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-06-14 | 1993-12-14 | 1994-06-15 | $7700.00 | Window Closed / Lapsed |