US4342616A
Expired / Lapsed
US
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Technique for predicting oxygen precipitation in semiconductor wafers
Assignee: International Business Machines Corp
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Filing: 1981-02-17
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Granted: 1982-08-03
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Expires: 2001-02-17
Abstract
Abstract A method or technique is disclosed for predicting precisely where oxygen precipitation will occur in semiconductor wafers that are being processed in connection with integrated circuit manufacture; the technique is based upon the discovery that such precipitation will occur at resistivity peaks measured prior to any thermal treatment of the wafers. In other words, the technique permits characterizing the wafers by the diametral resistivity profile that is obtained in the initial resistivity measurements, whereby a change in oxygen precipitation can be predicted precisely where compensated intrinsic regions have been measured in the initial measurements.
Inventors
- 👤 Brian J. Elliott
- 👤 Eric W. Hearn
- 👤 Gary Markovits
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:04
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/80; H10D62/83; H10D62/834; G; G01; G01N; G01N27/00; G01N27/02; G01N27/04; G01N27/041; H10P; H10P36/00; H10P36/20; Y; Y10; Y10S; Y10S117/00; Y10S117/916
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
125 words
A process for characterizing semiconductor wafers, which have been cut from a crystalline body for purposes of integrated circuit manufacture, comprising the steps of: measuring, prior to any thermal treatment, the resistivity at a plurality of sites along the diameter of the wafers; characterizing such wafers by the diametral resistivity profile thus obtained, according to which changes in oxygen preciptation can be predicted precisely where compensated intrinsic regions have been measured; and, classifying said wafers based on the predicted oxygen precipitation characterisitcs, such that wafers having a substantially uniform diametral resistivity profile can be immediately used on a conventional production line, whereas the remaining wafers can be retained for use in accordance with their predicted individual precipitation characteristics corresponding with the measured compensated intrinsic regions.
Claim 2
Dependent Claim
125 words
A process for characterizing semiconductor wafers, which have been cut from a crystalline body for purposes of integrated circuit manufacture, comprising the steps of: measuring, prior to any thermal treatment, the resistivity at a plurality of sites along the diameter of the wafers; characterizing such wafers by the diametral resistivity profile thus obtained, according to which changes in oxygen preciptation can be predicted precisely where compensated intrinsic regions have been measured; and, classifying said wafers based on the predicted oxygen precipitation characterisitcs, such that wafers having a substantially uniform diametral resistivity profile can be immediately used on a conventional production line, whereas the remaining wafers can be retained for use in accordance with their predicted individual precipitation characteristics corresponding with the measured compensated intrinsic regions.
Claim 3
Dependent Claim
35 words
A process as defined in claim 1, in which an annular region at the edge of the wafers and defining the final oxygen precipitation profile, corresponds with compensated intrinsic regions measured by the first step.
Claim 4
Dependent Claim
16 words
A process as defined in claim 1, in which said semiconductor wafers are of monocrystalline silicon.
Claim 5
Dependent Claim
36 words
A process as defined in claim 1, further including the step of feeding back the resistivity information obtained by step 1 to the crystal growth operation so as to correct any predicted, undesired oxygen precipitation characteristic.
References Cited (Backward Citations)
US3669757A
Cited
US3805160A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-08-02 | 1986-02-01 | 1986-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-08-02 | 1990-02-01 | 1990-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-08-02 | 1994-02-01 | 1994-08-03 | $7700.00 | Window Closed / Lapsed |