Abstract In an apparatus for the assembly of microcomponents semiconductor devices, an improvement is provided for the step involving wire bonding of thin gold wires between conductor pads on the semiconductor chip and the external leads. In this type of apparatus generally, the wire bonding step involves the bonding of thin gold conductor wires between the conductor pads and the external leads. In the type apparatus wherein the present invention is provided, a lower anvil articular upward to a position underneath and supporting the semiconductor chip during the bonding process and then articulates downward away from the chip after bonding. The wires are placed and bonded by a capillary tube which articulates between positions above the bonding pads of the chip and the leads. The improvement comprises a wall disposed from the lower anvil and surrounding the chip between the conducting pads and the leads, whereby the wires are supported by the wall as they are withdrawn from the capillary tube.
In an apparatus for the assembly of microcomponent semiconductor devices wherein there is accomplished a step in which thin conductor wires are bonded between bonding pads on a semiconductor chip and leads for connecting the semiconductor or device to an external circuit, wherein a capillary tube from which the wire is drawn articulates between positions above a bonding pad of the chip and above a corresponding lead, and wherein a lower anvil reciprocates upward to a position underneath and supporting the chip during the bonding step and then downward away from the semiconductor chip after the bonding step, the improvement comprising a vertical wall projecting upwardly from the upper surface of the lower anvil and surrounding the chip between the bonding pads and the leads during the bonding step, the vertical height of the wall being greater than the vertical height of the chip and the leads so that the wires, after being bonded to the bonding pads, are supported by the wall as the wires are withdrawn from the capillary tube and bonded to the leads.
Claim 2
Dependent Claim
177 words
In an apparatus for the assembly of microcomponent semiconductor devices wherein there is accomplished a step in which thin conductor wires are bonded between bonding pads on a semiconductor chip and leads for connecting the semiconductor or device to an external circuit, wherein a capillary tube from which the wire is drawn articulates between positions above a bonding pad of the chip and above a corresponding lead, and wherein a lower anvil reciprocates upward to a position underneath and supporting the chip during the bonding step and then downward away from the semiconductor chip after the bonding step, the improvement comprising a vertical wall projecting upwardly from the upper surface of the lower anvil and surrounding the chip between the bonding pads and the leads during the bonding step, the vertical height of the wall being greater than the vertical height of the chip and the leads so that the wires, after being bonded to the bonding pads, are supported by the wall as the wires are withdrawn from the capillary tube and bonded to the leads.